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Showing results 1 to 14 of 14

1
Bio-inspired Synthesis of Noble Metal-Polydopamine Hybrid Nanostructures on Electrospun Polymer Nanofibers

Son, HY; Yoo JH; Lee, HS; Nam, YoonSung, 2013 Materials Research Society Fall Meeting, Materials Research Society, 2013-12-01

2
Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications

Son, HY; Jung, GJ; Lee, JK; Choi, JY; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.864 - 871, IEEE, 2007-05-29

3
Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with Electroless Nickel Immersion Gold (ENIG) surface finish

Park, YS; Kwon, YM; Son, HY; Moon, JT; Jeong, BW; Kang, KI; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging, EMAP 2007, pp.0, 123, 2007-11-19

4
Embedded chip-in-flex (cif) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs)

Suk, KL; Son, HY; Chung, CK; Kim, JD; Lee, JW; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, ECTC 2009, pp.1741 - 1748, 2009-05-26

5
Formation of Pb/63Sn Solder Bumps using a Solder Droplet Jetting Method

Son, HY; Gam, SA; Paik, Kyung-Wook, Formation of Pb/63Sn Solder Bumps using a Solder Droplet Jetting Method, pp.147 - 152, 2004-12

6
Formation of Pb/63Sn solder bumps using a solder droplet jetting method

Son, HY; Nah, JW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.28, no.3, pp.274 - 281, 2005-07

7
Patterning of wafer level applied non-conductive adhesives (NCAs) for camera image sensor (CIS) modules

Kim, I; Son, HY; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.1806 - 1810, 2009-05-26

8
Studies on double-layered metal bumps for fine pitch flip chip applications

Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; et al, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11

9
Theoretical prediction and experimental measurement of the degree-of-cure of Anisotropic Conductive Film (ACF) for Chip-On-Flex (COF) applications

Chung, CK; Kwon, YM; Kim, I; Son, HY; Choo, KS; Kim, SJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 123, 2007-11-19

10
Wafer level ACA packages and their applications to advanced electronic packaging

Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09

11
Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections

Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30

12
Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections

Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27

13
Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs)

Paik, Kyung-Wook; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 123, 2007-01-15

14
Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs)

Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07

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