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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Studies on double-layered metal bumps for fine pitch flip chip applications

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Son, HY / Yeo, YW / Jung, GJ / Lee, JK / Choi, JY / Park, CJ / Suh, MS / Cho, SJ / Paik, Kyung-Wookresearcher
Issue Date
2005-12-11
Language
ENG
Citation

EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100

URI
http://hdl.handle.net/10203/143544
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MS-Conference Papers(학술회의논문)
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