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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications

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Son, HY / Jung, GJ / Lee, JK / Choi, JY / Paik, Kyung-Wookresearcher
Publisher
IEEE
Issue Date
2007-05-29
Language
English
Citation

57th Electronic Components and Technology Conference 2007, ECTC '07, pp.864 - 871

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1230
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MS-Conference Papers(학술회의논문)
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