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Paik, Kyung-Wook (백경욱)
교수, Department of Materials Science & Engineering(신소재공학과)

http://npil.kaist.ac.kr

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    NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
    1
    Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking

    Tian, Ye; Fang, Heng; Ren, Ning; et al, JOURNAL OF ALLOYS AND COMPOUNDS, v.828, 2020-07

    2
    Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn-Ag Bumps

    Lee, Hanmin; Lee, Seyong; Choi, Taejin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.5, pp.924 - 928, 2020-05

    3
    A Study on Polyvinylidene Difluoride (PVDF) Anchoring Polymer Layer (APL) Solder Anisotropic Conductive Films (ACFs) for Fine-Pitch Flex-on-Flex (FOF) Interconnection

    Song, Lu; Yoon, Dal-Jin; Zhang, Shuye; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.368 - 377, 2020-03

    4
    A Study on the Flexible Chip-on-Fabric Assemblies Using Anisotropic Conductive Films and Metal-Laminated Fabric Substrates

    Jung, Seung-Yoon; Lee, Tae-Ik; Cho, Minsun; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.360 - 367, 2020-03

    5
    A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films

    Jung, Seung-Yoon; Oh, Seung Jin; Lee, Tae-Ik; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.1, pp.176 - 183, 2020-01

    6
    IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints

    Ren, Ning; Fang, Heng; Wang, Dong; et al, MATERIALS, v.13, no.1, 2020-01

    7
    Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers

    Park, Jae-Hyeong; Park, Jong Cheol; Shin, SangMyung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.11, pp.2152 - 2159, 2019-11

    8
    Wettability and interfacial morphology of Sn-3.0Ag-0.5Cu solder on electroless nickel plated ZnS transparent ceramic

    Zhang, Shuye; Zhu, Bingxuan; Zhou, Xiang; et al, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.19, pp.17972 - 17985, 2019-10

    9
    Piezoelectric Ceramics and Flexible Printed Circuits' Interconnection Using Sn58Bi Solder Anisotropic Conductive Films for Flexible Ultrasound Transducer Assembly

    Park, Jae-Hyeong; Park, Jong Cheol; Lee, SeYong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.9, pp.1897 - 1903, 2019-09

    10
    A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties

    Byeon, Jun-Ho; Yoon, Dal Jin; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.7, pp.1235 - 1243, 2019-07

    11
    The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-mu m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection

    Lee, Seyong; Lee, Hanmin; Shin, SangMyung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.6, pp.1167 - 1175, 2019-06

    12
    A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

    Zhang, Shuye; Qi, Xiaoquan; Yang, Ming; et al, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.10, pp.9171 - 9183, 2019-05

    13
    Effects of Polyacrylonitrile Anchoring Polymer Layer Solder Anisotropic Conductive Films on the Solder Ball Movement for Fine-Pitch Flex-on-Flex (FOF) Assembly

    Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.5, pp.830 - 835, 2019-05

    14
    Direct Visualization of Cross-Sectional Strain Distribution in Flexible Devices

    Lee, Tae-Ik; Jo, Woosung; Kim, Wansun; et al, ACS APPLIED MATERIALS & INTERFACES, v.11, no.14, pp.13416 - 13422, 2019-04

    15
    Effects of the Types of Anisotropic Conductive Films on the Bending Reliability of Chip-in-Plastic Packages

    Kim, Ji-Hyun; Kim, Ji-Hye; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.3, pp.405 - 411, 2019-03

    16
    A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20-mu m Fine-Pitch Interconnection

    Lee, Sang-Hoon; Yoon, Dal-Jin; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.2, pp.209 - 215, 2019-02

    17
    The Effect of the Thermal Mechanical Properties of Nonconductive Films on the Thermal Cycle Reliability of 40-mu m Fine Pitch Cu-Pillar/Ni/SnAg Microbump Flip-Chip Assembly

    Lee, SeYong; Park, JongHo; Park, Jae-Hyeong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.10 - 17, 2019-01

    18
    Effects of the Nylon Anchoring Polymer Layer on the Conductive Particle Movements of Anisotropic Conductive Films for Ultrafine Pitch Chip-on-Glass Applications

    Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.10, pp.1723 - 1728, 2018-10

    19
    Effects of Flux Activator Addition in Nanofiber/Solder Anisotropic Conductive Films (ACFs) on the Solder Wettability of Flex-on-Flex (FOF) Assembly

    Lee, Ji-Soo; Kim, Ji-Hye; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.7, pp.1316 - 1322, 2018-07

    20
    Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging

    Lee, Dongju; Lee, Seyong; Byun, Segi; et al, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.107, pp.217 - 223, 2018-04
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