Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs)

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Issue Date
2007-01-15
Language
ENG
Citation

Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158

URI
http://hdl.handle.net/10203/153633
Appears in Collection
MS-Conference Papers(학술회의논문)
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