Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs)

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Recently, wafer-level packaging (WLP) has become one of the promising packaging technologies due to its advantages, such as fewer processing steps, lower cost, and enhanced device performance compared to conventional single-chip packaging. Many developments on new WLP design, material, and process have been accomplished according to performance and reliability requirement of the devices to be packaged [11, [2]. For a lower cost, higher performance, and environmentally green packaging process, anisotropic conductive film (ACF) flip chip assembly has been widely used, such as in ultrafine-pitch flat panel display (FPD) and general semiconductor packaging applications, too. However, there has been no previous attempt on the wafer-level flip chip assembly using ACFs. In this paper, wafer-level flip chip packages using preapplied ACFs were investigated. After ACF prelamination on an electroplated An bumped wafer, and subsequent singulation, singulated chips were flip-chip assemble on an organic substrate using a thermocompression bonding method. Au-plated bumps were well assembled on Ni/Au pads of organic substrates. The electrical, mechanical properties and the reliabilities of wafer-level flip chip assemblies (WL-FCAs) were evaluated and compared with conventional ACF flip chip assemblies using the thermocompression method. Contact resistance measurement was performed after thermal cycling, high temperature/humidity, and pressure cooker test. ACF joints between electroplated An bumps and substrate metal pads showed stable contact resistance of 5 mn per a bump, strong bump adhesion, and similar reliability behaviors compared with conventional ACF flip chip joints using a thermocompression bonding. As a summary, new wafer-level packages using preapplied ACFs were successfully demonstrated for flip chip assembly. The new wafer-level packages using preapplied ACFs can be widely used for many nonsolder flip chip assembly applications such as chip-on-board (COB), chip-on-flex (COF), and chip-on-glass (COG).
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2007-07
Language
English
Article Type
Article
Citation

IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227

ISSN
1521-334X
DOI
10.1109/TEPM.2007.899151
URI
http://hdl.handle.net/10203/1393
Appears in Collection
MS-Journal Papers(저널논문)
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