Embedded chip-in-flex (cif) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs)
- Issue Date
- 2009-05-26
- Language
- ENG
- Citation
59th Electronic Components and Technology Conference, ECTC 2009, pp.1741 - 1748
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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