Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Lee, JS

Showing results 1 to 47 of 47

1
A fluxless flip chip bonding for VCSEL arrays using silver coated indium solder bumps

Chu, KM; Lee, JS; Cho, HS; Park, HH; Jeon, Duk Young, Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), pp.110 - 116, 2004-01-05

2
A study on the microstructure of preferred orientation of lead zirconate titanate (PZT) thin films

Kim, CJ; Yoon, DS; Lee, JS; Choi, CG; No, Kwangsoo, JOURNAL OF MATERIALS RESEARCH, v.12, no.4, pp.1043 - 1047, 1997-04

3
Blow forming of superplastic 7475 Al Alloy sheets

Jeong, SG; Choi, JH; Lee, DN; Lee, HyuckMo; Hong, SH; Hong, SS; Lee, JS, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.29, no.4, pp.379 - 388, 1991-04

4
Characteristics of indium bump for flip-chip bonding used in polymeric-waveguide-integrated optical interconnection systems

Chu, KM; Lee, JS; Cho, HS; Rho, BS; Park, HyoHoon; Jeon, DukYoung, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.43, no.8B, pp.5922 - 5927, 2004-08

5
CHARACTERIZATION OF ION-BEAM DEPOSITED REFRACTORY WNX FILMS ON GAAS

Lee, JS; Park, Chul Soon; Kang, JY; Ma, DS; Lee, Jeong Yong, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.8, no.5, pp.1117 - 1121, 1990-10

6
Composition, oxidation, and optical properties of fluorinated silicon nitride film by inductively coupled plasma enhanced chemical vapor deposition

Jun, BH; Lee, JS; Kim, DW; Sung, TH; Bae, Byeong-Soo; No, Kwangsoo, JOURNAL OF MATERIALS RESEARCH, v.14, no.3, pp.995 - 1001, 1999-03

7
Dependence of the properties of (SrxTi1-x)O-3 thin films deposited by plasma-enhanced metal-organic chemical vapor deposition on electron cyclotron resonance plasma

Lee, JS; Song, HW; Jun, BH; Kwack, DH; Yu, BG; Jiang, ZT; No, Kwangsoo, THIN SOLID FILMS, v.301, no.1-2, pp.154 - 161, 1997-06

8
Deposition and characterization of epitaxial oxide layers on Si substrates

Lee, Won-Jong; No, Kwangsoo; Song, HW; Lee, JS; Lee, HC; Hwang, DS; Jiang, ZT; et al, Proceedings of the 13th Korea-Japan seminar on new ceramics, 409, pp.409 - 413, 1997-01-01

9
Dielectric properties of SrTiO3, and BST thin films fabricated using ECR-PEMOCVD

Lee, JS; Kim, KS; Kim, E; No, Kwangsoo, INTEGRATED FERROELECTRICS, v.21, no.1-4, pp.343 - 353, 1998

10
Effect of pore size of mesoporous molecular sieves (MCM-41) on Al stability and acidity

Feng, XB; Lee, JS; Lee, JW; Lee, JeongYong; Wei, D; Haller, GL, CHEMICAL ENGINEERING JOURNAL, v.64, no.2, pp.255 - 263, 1996-11

11
Effect of prior austenite microstructure on austenite/ferrite transformation of fine grained high strength low alloy steel

Bae, YH; Hong, Soon-Hyung; Lee, JS; Choi, JK; Choo, WY, Thermec 2003 Processing and Manufacturing of Advanced Materials, no.2, pp.1583 - 1588, 2003-07-07

12
Effect of prior austenite microstructure on austenite/ferrite transformation of fine grained high strength low alloy steel

Bae, YH; Hong, Soon-Hyung; Lee, JS; Choi, JK; Choo, WY, THERMEC2003, PTS 1-5 BOOK SERIES: MATERIALS SCIENCE FORUM, v.426-4, pp.1583 - 1588, 2003-06

13
Effect of the deposition geometry on the electrical properties within Tin-doped indium oxide film deposited under a given RF magnetron sputtering condition

You, DJ; Choi, Si-Kyung; Han, HS; Lee, JS; Lim, CB, THIN SOLID FILMS, v.401, no.1-2, pp.229 - 234, 2001-12

14
Effects of austenite conditioning on austenite/ferrite phase transformation of HSLA steel

Bae, YH; Lee, JS; Choi, JK; Choo, WY; Hong, Soon-Hyung, MATERIALS TRANSACTIONS, v.45, pp.137 - 142, 2004-01

15
Effects of buffer layer on the fabrication and characteristics of ferroelectric thin films

Song, HW; Lee, JS; Kim, DW; Kim, KH; Sung, TH; No, Kwangsoo, Proceedings of the 1997 MRS Fall Symposium, pp.471 - 476, MRS, 1997-11-30

16
Effects of La concentration on the texturing and the electrical properties of sol-gel derived PLT thin films

Choi, CG; Kim, CJ; Yoon, DS; Lee, JS; Lee, Won-Jong; No, Kwangsoo, METALS AND MATERIALS INTERNATIONAL, v.4, no.1, pp.83 - 87, 1998-01

17
Effects of NH3 Carrier Gas on the Deposition and Electrical Characterics of SrTiO3 Films Grown by ECR Plasma Assisted MOCVD

No, Kwangsoo; Lee, JS; Song, HW; Jun, BH; Yu, BG, International Symposium on Applications of Ferroelectric Thin Films, 1996-01-01

18
Effects of process parameters on titanium dioxide thin film deposited using ECR MOCVD

Lee, JS; Song, HW; Lee, WJ; Yu, BG; No, Kwangsoo, THIN SOLID FILMS, v.287, no.1-2, pp.120 - 124, 1996-10

19
Effects of Seeding Layer on Orientation and Phase-formation of Sol-gel-derived Lanthanum-modified Lead-Zirconate-Titanate films on Glass

Lee, JS; Kim, CJ; Yoon, DS; Choi, CG; No, Kwangsoo, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.34, no.4A, pp.1947 - 1951, 1995-04

20
Electrical properties of a-axis aligned lanthanum-modified lead titanate thin films prepared using sol-gel process

Yoon, DS; Kim, CJ; Lee, JS; Choi, CG; Lee, Won-Jong; No, Kwangsoo, METALS AND MATERIALS-KOREA, v.3, no.4, pp.277 - 282, 1997

21
Electrical properties of BST thin films prepared by ECR-PEMOCVD

Lee, JS; Bae, JS; Song, HW; Jun, BH; No, Kwangsoo, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.32, pp.1430 - 4, 1998-02

22
Fabrication and characterization of BaxSr1-xTiO3/YBa(2)Cu3O(x)/SrTiO3 structure

Choi, J; Kim, E; Park, SY; Lee, JS; Sung, TH; Park, Y; No, Kwangsoo, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.41, no.9, pp.5567 - 5571, 2002-09

23
Fabrication and characterization of electrically tunable high-T-c superconducting resonators incorporating barium strontium titanate as a tuning material

Lee, EH; Sok, J; Park, SJ; Lee, JS; Song, IH; Kwak, J; Jung, KR; et al, SUPERCONDUCTOR SCIENCE TECHNOLOGY, v.12, no.11, pp.981 - 984, 1999-11

24
Field emission characteristics of COSi2/TaN-coated silicon emitter tips

Han, BW; Lee, JS; Ahn, Byung Tae, IEEE ELECTRON DEVICE LETTERS, v.23, no.1, pp.10 - 12, 2002-01

25
Fluorinated silicon nitride film for the bottom antireflective layer in quarter micron optical lithography

Jun, BH; Han, SS; Lee, JS; Kim, YB; Kang, HY; Koh, YB; Bae, Byeong-Soo; et al, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v.12, no.7, pp.921 - 926, 1997-07

26
Formability of Superplastic Al Alloy Sheets

Lee, Hyuck Mo; Lee, DN; Jeong, SK; Choi, JH; Hong, SH; Hong, SS; Lee, JS, Conference on Superplastic Forming

27
Formation and Characterization of Co-Reinforced Sn-3.5Ag Solder

Jeon, Duk Young; Lee, JS; Chu, KM; Patzelt, R; Manessis, D; Ostmann, A, KAIST/GIST/Postech/Kyoto/Tohoku Univ. Joint Symposium, 2006

28
Formation and characterization of cobalt-reinforced Sn-3.5Ag solder

Lee, JS; Chu, KM; Jeon, Duk Young; Patzelt, R; Manessis, D; Ostmann, A, IEEE 56th Electronic Components and Technology Conference, pp.244 - 249, IEEE, 2006-05-30

29
Formation of Equilibrium and Metastable Eutectics Near the Ni3Al Composition

Wee, Dang-Moon; Lee, JS; Lu, Y; Lee, JH; Oh, MH; Hirano, T, 2004 MST meeting (TMS Fall meeting), 2004

30
Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist

Lee, JS; Chu, KM; Park, HyoHoon; Jeon, DukYoung, Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), pp.117 - 122, AGEC, 2004-01-05

31
Formation of Sn-multiwalled carbon nanotube composite layer for the application of thermal interface materials

Lee, JS; Vaidyanathan, S; Jeon, Duk Young, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 123, 2007-11-19

32
Improvement of adhesion and microwave transmission characteristics of indium bump by silver coating for low temperature flip-chip applications

Chu, KM; Choi, JH; Lee, JS; Cho, HS; Park, SeongOok; Park, HyoHoon; Jeon, DukYoung, Materials, Intergration and Packaging Issues for High-Frequency Devices II, pp.75 - 80, Materials Research Society Symposium, 2004-11-29

33
Isopropanol Effects On The Phase-Formation And Texturing Of Sol-Gel Derived PMN Thin-Films

Lee, JS; Kim, CJ; Yoon, DS; Choi, CG; Woo, SS; No, Kwangsoo, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, v.34, no.6A, pp.716 - 719, 1995-06

34
Mass spectroscopic study for vaporization characteristics of Ba(TMHD)(2) and Sr(TMHD)(2) in electron cyclotron resonance-plasma enhanced metal organic chemical vapor deposition

Lee, JS; Song, HW; Kim, KS; Yu, BG; Jeong, YH; Jiang, ZT; No, Kwangsoo, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.15, no.1, pp.72 - 76, 1997

35
Multiple Flip-chip Assembly for Hybrid Compact Optoelectronic Modules using Electroplated AuSn Solder Bumps

Jeon, Duk Young; Chu, KM; Lee, JS; Oppermann, H; Engelmann, G; Wolf, J; Reichl, H, IMAPS 2006 (39th International Symposium on Microelectronics 2006), pp.653 -, 2006

36
Optoelectronic and microwave characteristics of silver coated indium bumps for low temperature flip-chip applications

Chu, KM; Choi, JH; Lee, JS; Cho, HS; Park, SeongOok; Park, HyoHoon; Jeon, DukYoung, ELECTRONICS LETTERS, v.40, no.23, pp.1508 - 1509, 2004-11

37
Preparation and characterization of coenzyme Q(10)-loaded PMMA nanoparticles by a new emulsification process based on microfluidization

Kwon, SS; Nam, YoonSung; Lee, JS; Ku, BS; Han, SH; Lee, JY; Chang, IS, COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, v.210, no.1, pp.95 - 104, 2002-10

38
Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps

Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11

39
Solid-phase synthesis of styryl dyes and their application as amyloid sensors

Li, QA; Lee, JS; Ha, C; Park, Chan Beum; Yang, G; Gan, WB; Chang, YT, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, v.43, no.46, pp.6331 - 6335, 2004

40
Strategy to Control Defects in Graphene Synthesis and Its Effect to Material Properties

Song, SH; Lee, JS; Jin, SH; Hwang, JW; Back, JU; Kim, JM; Kim, BH; et al, 2013 RPGR (Recent Progress in Graphene Research) conferences, RPGR, 2013-09-12

41
Successive Multiple Flip-chip Assembly using Gold-tin Solder Bump for a Compact Optoelectronic Module

Jeon, Duk Young; Chu, KM; Lee, JS; Oppermann, H; Engelmann, G; Wolf, J; Reichl, H, 2006 Microoptics Conference (The Joint International Conference on Plastic Optical Fiber and Microoptics 2006), pp.78 -, 2006

42
Synthesis and photoluminescence properties of BaGa2S 4: Eu2+ phosphor for white light-emitting diodes

Yoo, HS; Park, BJ; Im, WB; Lee, JS; Jeon, Duk Young, 14th International Display Workshops, IDW '07, pp.953 - 955, 123, 2007-12-05

43
Synthesis of low temperature burnable P(MMA-co-BMA) binder and control of carbon residue during baking process of BAM phosphor paste

Kim, SW; Lee, S; Im, WB; Lee, JS; Jang, HS; Yoo, HS; Jeon, Duk Young, 14th International Display Workshops, IDW '07, pp.877 - 879, 2007-12-05

44
TEXTURING AND ELECTRICAL CHARACTERISTICS OF SOL-GEL DERIVED FERROELECTRIC THIN-FILMS

No, Kwangsoo; Kim, CJ; Yoon, DS; Lee, JS; Choi, CG; Lee, Won-Jong; Bae, Byeong-Soo, INTEGRATED FERROELECTRICS, v.9, no.1-3, pp.159 - 168, 1995

45
THERMAL STABILITIES AND MICROSTRUCTURES OF TUNGSTEN COMPOUND CONTACTS ON N-GAAS FABRICATED BY LOW-ENERGY ION-BEAM-ASSISTED DEPOSITION

Park, Chul Soon; Lee, JS; Kang, JY; Lee, Jeong Yong, APPLIED PHYSICS LETTERS, v.59, no.14, pp.1767 - 1769, 1991-09

46
Titanium oxide film for the bottom antireflective layer in deep ultraviolet lithography

Jun, BH; Han, SS; Kim, KS; Lee, JS; Jiang, ZT; Bae, Byeong-Soo; No, Kwangsoo; et al, APPLIED OPTICS, v.36, no.7, pp.1482 - 1486, 1997-03

47
Vitamin A microencapsulation within poly(methyl methacrylate)-g-polyethylenimine microspheres: Localized proton buffering effect on vitamin A stability

Lee, JS; Nam, YoonSung; Kang, BY; Han, SH; Chang, IS, JOURNAL OF APPLIED POLYMER SCIENCE, v.92, pp.517 - 522, 2004-04

rss_1.0 rss_2.0 atom_1.0