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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist

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Lee, JS / Chu, KM / Park, HyoHoonresearcher / Jeon, DukYoungresearcher
Publisher
AGEC
Issue Date
2004-01-05
Language
ENG
Citation

Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), pp.117 - 122

URI
http://hdl.handle.net/10203/141102
Appears in Collection
MS-Conference Papers(학술회의논문)
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