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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

A fluxless flip chip bonding for VCSEL arrays using silver coated indium solder bumps

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Chu, KM / Lee, JS / Cho, HS / Park, HH / Jeon, Duk Youngresearcher
Issue Date
2004-01-05
Language
ENG
Citation

Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), pp.110 - 116

URI
http://hdl.handle.net/10203/141591
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MS-Conference Papers(학술회의논문)
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