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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

A fluxless flip chip bonding for VCSEL arrays using silver coated indium solder bumps

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dc.contributor.authorChu, KM-
dc.contributor.authorLee, JS-
dc.contributor.authorCho, HS-
dc.contributor.authorPark, HH-
dc.contributor.authorJeon, Duk Young-
dc.date.accessioned2013-03-17T08:27:34Z-
dc.date.available2013-03-17T08:27:34Z-
dc.date.created2012-02-06-
dc.date.issued2004-01-05-
dc.identifier.citationProceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), v., no., pp.110 - 116-
dc.identifier.urihttp://hdl.handle.net/10203/141591-
dc.languageENG-
dc.titleA fluxless flip chip bonding for VCSEL arrays using silver coated indium solder bumps-
dc.typeConference-
dc.identifier.scopusid2-s2.0-2342460213-
dc.type.rimsCONF-
dc.citation.beginningpage110-
dc.citation.endingpage116-
dc.citation.publicationnameProceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC)-
dc.identifier.conferencecountryChina-
dc.identifier.conferencecountryChina-
dc.contributor.localauthorJeon, Duk Young-
dc.contributor.nonIdAuthorChu, KM-
dc.contributor.nonIdAuthorLee, JS-
dc.contributor.nonIdAuthorCho, HS-
dc.contributor.nonIdAuthorPark, HH-
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MS-Conference Papers(학술회의논문)
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