Improvement of adhesion and microwave transmission characteristics of indium bump by silver coating for low temperature flip-chip applications
- Publisher
- Materials Research Society Symposium
- Issue Date
- 2004-11-29
- Language
- English
- Citation
Materials, Intergration and Packaging Issues for High-Frequency Devices II, pp.75 - 80
- ISSN
- 0272-9172
- Appears in Collection
- EE-Conference Papers(학술회의논문)MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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