Improvement of adhesion and microwave transmission characteristics of indium bump by silver coating for low temperature flip-chip applications

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dc.contributor.authorChu, KMko
dc.contributor.authorChoi, JHko
dc.contributor.authorLee, JSko
dc.contributor.authorCho, HSko
dc.contributor.authorPark, SeongOokko
dc.contributor.authorPark, HyoHoonko
dc.contributor.authorJeon, DukYoungko
dc.date.accessioned2013-03-17T09:48:31Z-
dc.date.available2013-03-17T09:48:31Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2004-11-29-
dc.identifier.citationMaterials, Intergration and Packaging Issues for High-Frequency Devices II, pp.75 - 80-
dc.identifier.issn0272-9172-
dc.identifier.urihttp://hdl.handle.net/10203/142156-
dc.languageEnglish-
dc.publisherMaterials Research Society Symposium-
dc.titleImprovement of adhesion and microwave transmission characteristics of indium bump by silver coating for low temperature flip-chip applications-
dc.typeConference-
dc.identifier.wosid000229338900010-
dc.identifier.scopusid2-s2.0-20344379435-
dc.type.rimsCONF-
dc.citation.beginningpage75-
dc.citation.endingpage80-
dc.citation.publicationnameMaterials, Intergration and Packaging Issues for High-Frequency Devices II-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationBoston, MA-
dc.contributor.localauthorPark, SeongOok-
dc.contributor.localauthorPark, HyoHoon-
dc.contributor.localauthorJeon, DukYoung-
dc.contributor.nonIdAuthorChu, KM-
dc.contributor.nonIdAuthorChoi, JH-
dc.contributor.nonIdAuthorLee, JS-
dc.contributor.nonIdAuthorCho, HS-
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