Improvement of adhesion and microwave transmission characteristics of indium bump by silver coating for low temperature flip-chip applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chu, KM | ko |
| dc.contributor.author | Choi, JH | ko |
| dc.contributor.author | Lee, JS | ko |
| dc.contributor.author | Cho, HS | ko |
| dc.contributor.author | Park, SeongOok | ko |
| dc.contributor.author | Park, HyoHoon | ko |
| dc.contributor.author | Jeon, DukYoung | ko |
| dc.date.accessioned | 2013-03-17T09:48:31Z | - |
| dc.date.available | 2013-03-17T09:48:31Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2004-11-29 | - |
| dc.identifier.citation | Materials, Intergration and Packaging Issues for High-Frequency Devices II, pp.75 - 80 | - |
| dc.identifier.issn | 0272-9172 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/142156 | - |
| dc.language | English | - |
| dc.publisher | Materials Research Society Symposium | - |
| dc.title | Improvement of adhesion and microwave transmission characteristics of indium bump by silver coating for low temperature flip-chip applications | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000229338900010 | - |
| dc.identifier.scopusid | 2-s2.0-20344379435 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 75 | - |
| dc.citation.endingpage | 80 | - |
| dc.citation.publicationname | Materials, Intergration and Packaging Issues for High-Frequency Devices II | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Boston, MA | - |
| dc.contributor.localauthor | Park, SeongOok | - |
| dc.contributor.localauthor | Park, HyoHoon | - |
| dc.contributor.localauthor | Jeon, DukYoung | - |
| dc.contributor.nonIdAuthor | Chu, KM | - |
| dc.contributor.nonIdAuthor | Choi, JH | - |
| dc.contributor.nonIdAuthor | Lee, JS | - |
| dc.contributor.nonIdAuthor | Cho, HS | - |
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