Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Kim, JY
Showing results 1 to 49 of 49
| A study on correlation of low voltage cathodoluminescent properties with electrical conductivity of In2O3-coated ZnGa2O4 : Mn phosphors Kim, JY; Jeon, DukYoung; Yu, I; Yang, HG, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.147, no.9, pp.3559 - 3563, 2000-09 |
| A Study on luminescence enhancement and surface distribution of In2O3 and In2O3-coated ZnGa2O4:Mn phosphors Jeon, Duk Young; Kim, JY; Park, ZM; Yu, I; Yang, HG, Proceedings of the International Display Workshops, pp.849 - 852, 1999-01-01 |
| A study on the degradation of cathodoluminescence of SrTiO3 : Pr,Al,Ga phosphors tailored for low voltage display applications Kim, JY; You, YC; Jeon, DukYoung; Yu, I; Yang, HG, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.149, no.2, pp.44 - 48, 2002-02 |
| Annealing effects on the microstructural properties of the ZnO thin films grown on p-InP (100) substrates Yuk, Jong Min; Son, DI; Kim, TW; Kim, JY; Choi, WK, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.53, no.1, pp.357 - 360, 2008-07 |
| Characterization of nano-size YVO4 : Eu and (Y, Gd)VO4 : Eu phosphom by low voltage cathodo- and photoluminescence Kang, JH; Nazarov, M; Bin Im, W; Kim, JY; Jeon, DukYoung, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.23, no.2, pp.843 - 848, 2005-03 |
| Characterization of nano-size YVO4:Eu and (Y,Gd)VO 4:Eu phosphor via low voltage cathodoluminescence Kang, JH; Nazarov, M; Kim, JY; Jeon, Duk Young, Technical Digest of the 17th International Vacuum Nanoelectronics Conference, IVNC 2004, pp.122 - 123, 2004-07-11 |
| Correlation of photoluminescence of (Y, Ln)VO4 : Eu3+ (Ln = Gd and La) phosphors with their crystal structures Kang, JH; Im, WB; Lee, DC; Kim, JY; Jeon, DukYoung; Kang, YC; Jung, KY, SOLID STATE COMMUNICATIONS, v.133, no.10, pp.651 - 656, 2005-03 |
| Determination of Stress-Strain Curve for Microelectronic Solder Joint by ESPI Measurement and FE Analaysis Lee, BW; Jeong, JH; Jang, WS; Kim, JY; Kim, DW; Kwon, DI; Nah, JW; et al, The Third International Conference On Advanced Materials Development and Performance, Kyungpook National University, 2002-10 |
| Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis Lee, BW; Jeong, JH; Jang, W; Kim, JY; Kim, DW; Kwon, D; Nah, JW; et al, The Third International Conference On Advanced Materials Development and Performance, v.17, pp.1983 - 1988, The Third International Conference On Advanced Materials Development and Performance, 2003 |
| Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis Lee, BW; Jeong, JH; Jang, W; Kim, JY; Kim, DW; Kwon, D; Nah, JW; et al, INTERNATIONAL JOURNAL OF MODERN PHYSICS B, v.17, pp.1983 - 1988, 2003-04 |
| Development of Nanofibrous Transition Metal-Nitrogen-Carbon Based Catalysts for Oxygen Reduction Reaction Kim, MJ; Nam, DH; Yoo, SJ; Kim, JY; Jang, JH; Kim, HJ; Kwon, HS; et al, Materials Challenges in Alternative & Renewable Energy, The Korean Institute of Chemical Engineers, 2015-02-24 |
| Dynamic deformation and high velocity impact behaviors of Ti-6Al-4V alloys Kim, JY; Shim, IO; Kim, HK; Hong, SS; Hong, Soon-Hyung, MATERIALS SCIENCE FORUM, v.539-543, no.PART 3, pp.2269 - 2274, 2007 |
| Dynamic deformation and high velocity impact behaviors of Ti-6Al-4V alloys Kim, JY; Shim, IO; Kim, HK; Hong, Soon-Hyung, 5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2006, pp.2269 - 2274, International Conference on Processing and Manufacturing of Advanced Materials, 2006-07-04 |
| Effect of Cu content on the mechanical reliability of Ni/Sn-3.5Ag system Kim, JY; Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.3, pp.770 - 776, 2007-03 |
| Effect of electrodeposition conditions on Kirkendall void formation between electrodeposited Cu film and Sn-3.5Ag solder Kim, JY; Yu, Jin; Lee, TY, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1620 - 1625, 2007-05-29 |
| Effect of initial lamellar structure on globularization of hot multi-forged ELI grade Ti-6Al-4V alloy Kim, JY; Shim, IO; Hong, Soon-Hyung, 3rd International Conference on Recrystallization and Grain Growth, ReX GG III, v.558-559, no.PART 1, pp.529 - 532, 2007-06-10 |
| Effect of initial lamellar structure on globularization of hot multi-forged ELI grade Ti-6Al-4V alloy Kim, JY; Shim, IO; Hong, Soon-Hyung, MATERIALS SCIENCE FORUM, v.558-559, no.PART 1, pp.529 - 532, 2007-04 |
| Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging Jurenka, C; Kim, JY; Wolf, MJ; Engelmann, G; Ehrmann, O; Yu, Jin; Reichl, H, 55th Electronic Components and Technology Conference, ECTC 2005, v.1, pp.89 - 93, 2005-05-31 |
| Effect of thermal annealing on the microstructural properties of Al-doped ZnO thin films grown on n-Si (100) substrates Lee, Jeong Yong; Han, JH; No, YS; Kim, TW; Kim, JY; Choi, WK, 2nd International Conference on Microelectronics and Plasma Technology, 2009-09-22 |
| Effects of Variation of Cu UBM Thickness in Electrodeposited Pure Tin Solder Microbumps Yu, Jin; Kim, JY; Jurenka, C; Wolf, J; Engelmann, G; Herbert Reichl, EMAP 2004 Proceedings, pp.373 - 378, 2004 |
| Fabrication and characterization of electrically tunable high-T-c superconducting resonators incorporating barium strontium titanate as a tuning material Lee, EH; Sok, J; Park, SJ; Lee, JS; Song, IH; Kwak, J; Jung, KR; et al, SUPERCONDUCTOR SCIENCE TECHNOLOGY, v.12, no.11, pp.981 - 984, 1999-11 |
| Film growth model of atomic layer deposition for multicomponent thin films Kim, JH; Kim, JY; Kang, SW, JOURNAL OF APPLIED PHYSICS, v.97, no.9, 2005-05 |
| High Strain-Rate Deformation Behavior of NiAl/Ni Micro-Laminated Composites Hong, Soon Hyung; Kim, HY; Kim, JY; Jeong, DS; Enoki, M, The Korean Society for Composite Materials, pp.237 - 240, 복합재료학회, 2004 |
| Impact Reliabilities of Lead-free Solder Joints with Ni(P), Cu and Ni metallizations Yu, Jin; Sohn, YC; Kim, JY; Jee, YK; Ko, YH, ICEP 2006, 2006 |
| Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations Jee, YK; Kim, JY; Yu, Jin; Lee, TY, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.S1-b p3 -, 2007-11-19 |
| Interfacial Reactions between Lead-free Solders and Ni/Cu Dual-layer UBM Yu, Jin; Kim, JY; Sohn, YC, Micro System Technologies 2005 Proceedings, pp.337 - 344, 2005 |
| Investigation of electroplated Ni and Ni-Cu alloy UBM (Under Bump Metallurgy) with lead-free solders for flip chip packages Kim, SH; Kim, JY; Yu, Jin, 2002 International Symposium on Microelectronics, v.4931, pp.251 - 255, 2002-09-04 |
| Investigation of the characteristic changes on SrTiO3 : Pr,Al,Ga phosphors during low voltage electron irradiation Kim, JY; You, YC; Jeon, DukYoung; Yu, I; Yang, HG, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.21, no.1, pp.536 - 539, 2003-02 |
| Investigation of the characteristic changes on the SrTiO3 : Pr,Al,Ga phosphors during the low voltage electron irradiation Kim, JY; You, YC; Jeon, Duk Young; Yu, I; Yang, HG, Proceedings of the 14th International Vacuum Microelectronics Conference, pp.213 - 214, IEEE, 2001-08-12 |
| Luminescence mechanism of nano-size YVO4:Eu and Gd doped YVO4:Eu phosphors with enhanced luminescence Jeon, DukYoung; Kang, JH; Nazarov, M; Kim, JY, International Vacuum Nanoelectronics Conference, pp.P.2.13 -, 2004 |
| Morphology and cathodoluminescence of Li-doped SrTiO3:Pr3+,Ga3+, a red phosphor operating at low voltages Kim, JY; Jeon, Duk Young; Kang, SG; Kang, SY; Suh, KS, Luminescent and Lumiescent Materials, v.667, pp.G3.7.1 - G3.7.5, 2001-04-17 |
| Nanoscale continuous In2O3 coating on phosphor particles for improved low-voltage cathodoluminescent properties Kim, JY; You, YC; Kang, JH; Jeon, DukYoung; Yu, I, JOURNAL OF MATERIALS RESEARCH, v.18, no.7, pp.1505 - 1508, 2003-07 |
| New perspective in degradation mechanism of SrTiO3 : Pr,Al,Ga phosphors Kim, JY; You, YC; Kang, JH; Jeon, DukYoung; Weber, J, JOURNAL OF MATERIALS RESEARCH, v.19, no.9, pp.2694 - 2698, 2004-09 |
| Orientations of polycrystalline ZnO at the buried interface of oxide thin film transistors (TFTs): A grazing incidence X-ray diffraction study Kim, JY; Ko Park, Sang-Hee; Jeong, HY; Park, C; Choi, SY; Choi, JY; Han, SH; et al, BULLETIN OF THE KOREAN CHEMICAL SOCIETY, v.29, no.4, pp.727 - 728, 2008-04 |
| P and As implantation enhanced formation of metal-free oxide on WSi2 Lee, JG; Kim, JY; Lee, JeongYong; Roh, JS; Huh, JS, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.12A, pp.7140 - 7145, 1997-12 |
| Preparation and characterization of ZnGa2O4 phosphor synthesized with an optimized combustion process Kim, JY; Kang, JH; Lee, DC; Jeon, DukYoung, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.21, pp.532 - 535, 2003-01 |
| Preparation and characterization of ZnGa2O4 phosphor synthesized with an optimized combustion process Kim, JY; Lee, DC; Kang, JH; Jeon, Duk Young, 14th International Vacuum Microelectronics Conference, pp.211 - 212, Vacuum Microelectronics Conference, 2001-08-12 |
| Relaxation of cathodoluminescent characteristics of phosphors at low-energy electron excitation Bukesov, SA; Kim, JY; Jeon, DukYoung; Strel'tsov, AV, JOURNAL OF APPLIED PHYSICS, v.91, no.11, pp.9078 - 9082, 2002-06 |
| Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
| Soft materials nanoengineering by directed molecular assembly Jeong, SJ; Kim, JY; Moon, HS; Kim, Sang Ouk, 2010 10th IEEE Conference on Nanotechnology, NANO 2010, pp.41 - 45, IEEE, 2010-08-17 |
| Structurally Nanocrystalline-Electrically Single Crystalline ZnO-Reduced Graphene Oxide Composites Nam, Woo Hyun; Kim, Bo Bae; Seo, Seul Gi; Lim, Young Soo; Kim, JY; Seo, Won-Seon; Choi, Won Kook; et al, NANO LETTERS, v.14, no.9, pp.5104 - 5109, 2014-09 |
| Superconducting properties of well-shaped MgB2 single crystals Kim, KHP; Choi, JH; Jung, CU; Chowdhury, P; Lee, HS; Park, MS; Kim, HJ; et al, PHYSICAL REVIEW B, v.65, no.10, 2002-03 |
| Surface modification and low voltage cathodoluminescence of SrTiO3:Pr, Al, Ga phospohr Jeon, Duk Young; Kang, JH; Kim, JY; Bukesov, SA, 2004 International Display Workshops, pp.1119 - 1122, 2004 |
| Synthesis and characterization of orange-emitting SnO2 : Eu3+ phosphor by an optimized combustion method Kang, JH; Kim, JY; Jeon, DukYoung, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.152, no.3, pp.33 - 38, 2005 |
| The effect of addition of Gd, La into YVO4:Eu3+ red phosphor Jeon, Duk Young; Kang, JH; Im, WB; Lee, DC; Kim, JY, 2003 International Meeting on Information Display, pp.1017 - 1020, 2003 |
| The effects of electroplating parameters on the composition and morphology of Sn-Ag solder Kim, JY; Yu, Jin; Lee, JH; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1459 - 1464, 2004-12 |
| The effects of surface treatment for ZnS : Ag,Cl using a combination of stirring and ultrasonication in KOH solutions Lee, DC; Bukesov, SA; Lee, S; Kang, JH; Jeon, DukYoung; Park, DH; Kim, JY, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.11, pp.227 - 231, 2004 |
| The effects of surface treatment using stirring & ultrasonication in KOH solutions for blue phosphor ZnS:Ag,Cl Jeon, Duk Young; Lee, DC; Park, DH; Lee, S; Kim, JY, 2003 International Display Manufacturing Conference & FPD expo, pp.703 - 706, 2003 |
| Thermo-Mechanical Reliability of the Benzocyclobutane(BCB) film in a WLCSP Process Yu, Jin; Lee, KO; Kim, JY; Park, IS, Proc.3rd Electronic Materials and Packaging, pp.84 - 87, 2001 |
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