DSpace at KOASAS: Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis

DSpace at KOASAS

College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis

Cited 0 time in webofscience

Cited 0 time in

Hit : 353
Download : 0

Export

Lee, BW / Jeong, JH / Jang, W / Kim, JY / Kim, DW / Kwon, D / Nah, JW / Paik, Kyung-Wook researcher

Publisher: The Third International Conference On Advanced Materials Development and Performance

Issue Date: 2003

Language: ENG

Citation: The Third International Conference On Advanced Materials Development and Performance, v.17, pp.1983 - 1988

ISSN: 0217-9792

URI: http://hdl.handle.net/10203/150771

Appears in Collection: MS-Conference Papers(학술회의논문)

Files in This Item: There are no files associated with this item.

Display Full Item Record

qr_code

트윗하기

KOASAS

Knowledge Service Development Team, KAIST 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea. T. 82-42-350-4493 Email. koasas@kaist.ac.kr
Copyright © 2016. Korea Advanced Institute of Science and Technology. All Rights Reserved.

KOASAS

KOASAS

Browse

Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis

KOASAS

Communities & Collections