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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of Variation of Cu UBM Thickness in Electrodeposited Pure Tin Solder Microbumps

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Yu, Jinresearcher / Kim, JY / Jurenka, C / Wolf, J / Engelmann, G / Herbert Reichl
Issue Date
2004
Language
ENG
Citation

EMAP 2004 Proceedings, pp.373 - 378

URI
http://hdl.handle.net/10203/153490
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MS-Conference Papers(학술회의논문)
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