DSpace at KOASAS
College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Determination of Stress-Strain Curve for Microelectronic Solder Joint by ESPI Measurement and FE Analaysis

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 365
  • Download : 0
Export
Lee, BW / Jeong, JH / Jang, WS / Kim, JY / Kim, DW / Kwon, DI / Nah, JW / Paik Kyung-Wookresearcher
Publisher
Kyungpook National University
Issue Date
2002-10
Language
ENG
Citation

The Third International Conference On Advanced Materials Development and Performance

URI
http://hdl.handle.net/10203/137519
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

Display Full Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0