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Results 31-40 of 119 (Search time: 0.002 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27 | |
| Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs) for Organic Substrate Applications Cho, S; Hyun, JG; Paik, Kyung-Wook, 2003 International Electronic Packaging Technical Conference and Exhibition, v.2, pp.719 - 725, 2003-07-06 | |
| Study on thermal cycling reliability and delamination of anisotropic conductives adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Paik, Kyung-Wook, 3rd International IEEE Conference on Polymers and Adhesives In Microelectronics and Photonics, 2003-10 | |
| Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis Lee, BW; Jeong, JH; Jang, W; Kim, JY; Kim, DW; Kwon, D; Nah, JW; Paik, Kyung-Wook, The Third International Conference On Advanced Materials Development and Performance, v.17, pp.1983 - 1988, The Third International Conference On Advanced Materials Development and Performance, 2003 | |
| Multi-functional epoxy/SrTiO3 ceramic powder Embedded Capacitor Films(ECFs) for organic substrates Lee, S; Hyun, JG; Chung, CK; Paik, Kyung-Wook, 2006 8th Electronics Packaging Technology Conference, EPTC, pp.549 - 552, 2006-12-06 | |
| Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates Hyun, JG; Jang, KW; Cho, SD; Paik, Kyung-Wook; Kim, HS; Kim, JH, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.105 - 111, 2004-09-12 | |
| Experimental Analysis of Compressive Stresses in ACF Flip Chip Joint and Its Influence on ACF Joint Reliability Kwon, WS; Paik, Kyung-Wook, 2003 International Electronic Packaging Technical Conference and Exhibition, v.1, pp.131 - 136, 2003-07-06 | |
| Studies on double-layered metal bumps for fine pitch flip chip applications Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; Cho, SJ; Paik, Kyung-Wook, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11 | |
| Effects of BaTiO3 content and size on the viscosity and curing behavior of B-stage Epoxy/BaTiO3 composite Embedded Capacitor Films (ECFs) Jang, Jong Min; Lee, Sangyong; Paik, Kyung-Wook, The 11th International Conference on Electronic Materials and Packaging, 2009-12 | |
| Embedded chip-in-flex (cif) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs) Suk, KL; Son, HY; Chung, CK; Kim, JD; Lee, JW; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, ECTC 2009, pp.1741 - 1748, 2009-05-26 |