DSpace at KOASAS: Study on thermal cycling reliability and delamination of anisotropic conductives adhesives flip chip on organic substrates with emphasis on the thermal deformation

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Study on thermal cycling reliability and delamination of anisotropic conductives adhesives flip chip on organic substrates with emphasis on the thermal deformation

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Kwon, WS / Paik, Kyung-Wook researcher

Issue Date: 2003-10

Language: ENG

Citation: 3rd International IEEE Conference on Polymers and Adhesives In Microelectronics and Photonics

URI: http://hdl.handle.net/10203/143010

Appears in Collection: MS-Conference Papers(학술회의논문)

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Study on thermal cycling reliability and delamination of anisotropic conductives adhesives flip chip on organic substrates with emphasis on the thermal deformation

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