Browse "RIMS Conference Papers" by Author Kim, Choong Ki

Showing results 13 to 23 of 23

13
Model for the frequency dependence of charge pumping current in polycrystalline silicon thin film transistor

Lee Ga-Won; Lee Jung-Yeal; Choi Deuk-Sung; Hur Sung-Hoi; Kim, Choong Ki; Han Chul-Hi, Proceedings of the 1995 MRS Spring Meeting, v.378, pp.761 - 766, 1995-04-17

14
Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM)

Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS, pp.624 - 629, IEEE, 1999-01-17

15
Multilevel microstructure fabrication using single-step 3D photolithography and single-step electroplating

Yoon, Jun-Bo; Lee, JD; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Proceedings of the 1998 Conference on Materials and Device Characterization in Micromachining, pp.358 - 366, SPIE, 1998-09-21

16
NEW P-CHANNEL MOSFET STRUCTURE WITH SCHOTTKY-CLAMPED SOURCE AND DRAIN.

Oh C.S.; Koh Y.H.; Kim, Choong Ki, Technical Digest - International Electron Devices Meeting 1984., pp.609 - 612

17
Novel and High-Yield Fabrication of Electroplated 3D Micro-Coils for MEMS and Microelectronics

Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Micromachining and Microfabrication Process Technology IV, pp.233 - 240, Micromachining and Microfabrication Process Technology IV, 1998-09-21

18
Novel Fabrication of Electroplated 3D Micro-Coils Using 3D Photolithography of Thick Photoresist

Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, International Microprocesses and Nanotechnology Conference, pp.85 - 86, The Korean Institute of Telematics and Electronics, 1998-07

19
Novel monolithic and multilevel integration of high-precision 3-D microfluidic components

Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Proceedings of the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, pp.183 - 191, SPIE, 1998-09-21

20
Novel two-step baking process for high-aspect-ratio photolithography with conventional positive thick photoresist

Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Proceedings of the 1998 Conference on Materials and Device Characterization in Micromachining, pp.316 - 325, SPIE, 1998-09-21

21
Planarization and trench filling on severe surface topography with thick photoresist for MEMS

Yoon, Jun-Bo; Oh, G.Y.; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, pp.297 - 306, SPIE, 1998-09-21

22
Suppression of Leakage Current in Polysilicon NMOS Thin Film Transistors Using NH3 Annealing

Kim, Choong Ki; Chul-Hi Han, International Conference on Solid State Device and Materials, 1994

23
Uniform and Simultaneous Fabrication of High-Precision and High-Density Nozzles, Channels, and Cavities for Inkjet Printheads

Yoon, Jun-Bo; Kim, Choong Ki; Yoon, Euisik; Han, Chul-Hi, Proceedings of the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, v.3511, pp.214 - 224, 1998-09

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