Browse "RIMS Conference Papers" by Author Kim, Choong Ki
Showing results 11 to 23 of 23
| Improvement in HgCdTe diode characteristics by flip-chip bonded annealing Bae, S.-H.; Kim, Y.-H.; Kim, K.; Lee, Hee Chul; Kim, Choong Ki; Shin, HC, Infrared Technology and Applications XXIII, pp.104 - 110, SPIE, 1997-04-20 |
| Low Temperature Polysilicon TFT's with ECR plasma thermal oxide using Si2H6 source gas for active polysilicon film Kim, Choong Ki; Chul-Hi Han, 2nd International Semiconductor Device Research Symposium, 1994 |
| Model for the frequency dependence of charge pumping current in polycrystalline silicon thin film transistor Lee Ga-Won; Lee Jung-Yeal; Choi Deuk-Sung; Hur Sung-Hoi; Kim, Choong Ki; Han Chul-Hi, Proceedings of the 1995 MRS Spring Meeting, v.378, pp.761 - 766, 1995-04-17 |
| Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM) Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS, pp.624 - 629, IEEE, 1999-01-17 |
| Multilevel microstructure fabrication using single-step 3D photolithography and single-step electroplating Yoon, Jun-Bo; Lee, JD; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Proceedings of the 1998 Conference on Materials and Device Characterization in Micromachining, pp.358 - 366, SPIE, 1998-09-21 |
| NEW P-CHANNEL MOSFET STRUCTURE WITH SCHOTTKY-CLAMPED SOURCE AND DRAIN. Oh C.S.; Koh Y.H.; Kim, Choong Ki, Technical Digest - International Electron Devices Meeting 1984., pp.609 - 612 |
| Novel and High-Yield Fabrication of Electroplated 3D Micro-Coils for MEMS and Microelectronics Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Micromachining and Microfabrication Process Technology IV, pp.233 - 240, Micromachining and Microfabrication Process Technology IV, 1998-09-21 |
| Novel Fabrication of Electroplated 3D Micro-Coils Using 3D Photolithography of Thick Photoresist Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, International Microprocesses and Nanotechnology Conference, pp.85 - 86, The Korean Institute of Telematics and Electronics, 1998-07 |
| Novel monolithic and multilevel integration of high-precision 3-D microfluidic components Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Proceedings of the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, pp.183 - 191, SPIE, 1998-09-21 |
| Novel two-step baking process for high-aspect-ratio photolithography with conventional positive thick photoresist Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, Proceedings of the 1998 Conference on Materials and Device Characterization in Micromachining, pp.316 - 325, SPIE, 1998-09-21 |
| Planarization and trench filling on severe surface topography with thick photoresist for MEMS Yoon, Jun-Bo; Oh, G.Y.; Han, Chul-Hi; Yoon, Euisik; Kim, Choong Ki, the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, pp.297 - 306, SPIE, 1998-09-21 |
| Suppression of Leakage Current in Polysilicon NMOS Thin Film Transistors Using NH3 Annealing Kim, Choong Ki; Chul-Hi Han, International Conference on Solid State Device and Materials, 1994 |
| Uniform and Simultaneous Fabrication of High-Precision and High-Density Nozzles, Channels, and Cavities for Inkjet Printheads Yoon, Jun-Bo; Kim, Choong Ki; Yoon, Euisik; Han, Chul-Hi, Proceedings of the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, v.3511, pp.214 - 224, 1998-09 |
Discover
Type
- 3,515 Conference
Date issued
- 324 2020 - 2023
- 961 2010 - 2019
- 1,104 2000 - 2009
- 918 1990 - 1999
- 155 1980 - 1989