Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author KAIST

Showing results 65 to 124 of 207

65
Magnetic device with gate electrode

Park, Byong-Guk; Kang, Min-Gu; Choi, Jong-Guk

66
Magnetic logic device

Park, Byong-Guk; Kim, Kab-Jin; Lee, Geun-hee

67
Member for gas sensor, having a metal oxide semiconductor tube wall with micropores and macropores, gas sensor, and method for manufacturing same

Kim, Il-Doo; Jang, Ji Su; Kim, Sang-Joon; Choi, Seon-Jin, 2019-04-30

68
Member for gas sensor, having a metal oxide semiconductor tube wall with micropores and macropores, gas sensor, and method for manufacturing same

Kim, Il-Doo; Ji Su Jang; Kim, Sang-Joon; Choi, Seon-Jin

69
METHOD AND APPARATUS FOR MULTIPLEXED IMAGING OF BIOMOLECULE THROUGH ITERATIVE UNMIXING OF FLUOROPHORE SIGNALS

Chang, Jae-Byum; Yoon, Young-Gyu; Seo, Junyoung; Sim, Yeonbo; Kim, Jee Won

70
METHOD AND APPARATUS FOR MULTIPLEXED IMAGING OF BIOMOLECULES THROUGH ITERATIVE UNMIXING OF FLUOROPHORE SIGNALS

Chang, Jae-Byum; Yoon, Young-Gyu; Seo, Junyoung; Sim, Yeonbo; Kim, Jee Won

71
Method and apparatus for multiplexed imaging of spectrally-similar fluorophores

Chang, Jae-Byum; Yoon, Young-Gyu; Seo, Junyoung; Sim, Yeonbo

72
Method for bonding between electrical devices using ultrasonic vibration

Paik, Kyung-Wook; Yim, Myung-jin; Kim, Hyoung-joon; Lee, Ki-won

73
Method for fabricating chip size packages using lamination process

Paik, Kyung-Wook; Jang, Se Young

74
Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive

백경욱, 2003-02-11

75
Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method

Paik, Kyung-Wook; Nah, Jae Woong; Jeon, Young Doo; Yim, Myung Jin

76
Method for forming SBT ferroelectric thin film

Kim, Ho-Gi; Lee, Won Jae; Yoon, Soon Gil; Ahn, Joon Hyung

77
Method for Making Barium Titanate Dielectrics

Kang, Suk-Joong L; Lee, Byung Ke; Lee, Ho Yong; Chung, Sung Yoon, 2001-09-20

78
Method for making BaTiO3-based dielectric

강석중, 2002-03-19

79
Method for making n-type semiconductor diamond

Yu, Jin; Lee, Woong Sun; Kim, Jung Keun, 2000-08-01

80
Method for manufacturing conductive adhesive for high frequency flip chip package applications

Paik, Kyung-Wook; Yim, Myung jin; Kwon, Woon Seong

81
Method for manufacturing lithium-manganese oxide powders for use in lithium secondary battery

Kim, Ho-Gi; Kim, Ho Gi

82
Method for manufacturing SrTiO3series varistor using grain boundary segregation

강석중, 2010-05-11

83
Method for manufacturing surface-modified alumina-based ceramics

강석중, 2003-04-15

84
Method for packaging flexible device using holding wafer, and flexible device manufactured by the same

Paik, Kyung-Wook; Lee, Keon Jae; Hwang, Geon Tae; Yoo, Hyeon Kyun; Kim, Do Hyun; Kim, Yoo Sun, 2019-01-01

85
Method for preparation of oxide support-nanoparticle composites

Jung, WooChul; Kim, JunKyu; Koo, Bonjae

86
Method for preparing heteroepitaxial thin film

Chung, Sung Yoon; Kim, Suk Pil; Kang, Byung Sung; Choi, Si-Kyung; Kang, Suk-Joong L

87
Method for preparing inorganic-nanostructure composite material, method for preparing carbon nanotube composite using same, and carbon nanotube composite prepared thereby

김상욱; 이원준; 이덕현; 이진아, 2016-06-28

88
METHOD FOR PRODUCING GRAPHENES THROUGH THE PRODUCTION OF A GRAPHITE INTERCALATION COMPOUND USING SALTS

Jeon, Seok-Woo; Kang, Ki-Suk; Kwon, Ji-Young; Park, Kwang-Hyun; Seo, Dong-Hwa, 2015-07-14

89
Method for producing SiC preform with high volume fraction

Hong, Soon-Hyung; Lee, Hyo-Soo; Jeon, Kyung-Yoon, 2002-12-10

90
Method for separating nanogenerator and method for manufacturing nanogenerator using the same

Lee, Keon Jae; Byun, Myung Hwan; Park, Kwi Il; Hwang, Geon Tae; Chung, Chang Kyu, 2019-01-01

91
Method of bonding solder pads of flip-chip package

Yu, Jin; Lee, Woong-Sun

92
Method of fabricating multilayered UBM for flip chip interconnections by electroplating

Kim, Su Hyeon; Kim, Jong Yeon; Yu, Jin

93
Method of forming high-quality hexagonal boron nitride nanosheet using multi component eutectic point system

Jeon, Seokwoo; Hong, Soon-Hyung; Lee, Dong-Ju; Park, Kwang-Hyun, 2015-10-06

94
Method of manufacturing anisotropic conductive film using vertical ultrasonic waves

Paik, Kyung-Wook; Yoon, DalJin; Lee, SangHoon

95
Method of manufacturing barrier rib for plasma display panel

배병수, 2010-08-03

96
Method of manufacturing graphene using doped carbon materials

Kim, Sang Ouk; Lim, Joonwon; Lee, Ho Jin, 2018-10-23

97
Method of manufacturing lithium-manganese oxide for use in lithium secondary battery

Han, Yi Sup; Kim, Ho-Gi; Park, Kyu Sung

98
Method of manufacturing organic substrate with embedded active chip

Paik, Kyung-Wook; Son, Ho-Young

99
Method of preparing polymer composite using unidirectionally solidified giant magnetostrictive material

Hong, Soon Hyung; Kwon, Oh Yeoul; Park, Wonje; Lee, Zin Hyoung

100
Method of preparing polymer composite using unidirectionally solidified giant magnetostrictive material

Hong, Soon Hyung; Kwon, Oh Yeoul; Park, Won Je

101
Method of surface strengthening alumina-zirconia composites using MoO.sub.2

Kang, Suk-Joong L; Shin, Yu S.; Whang, Nong M.; Yoon, Duk Y.; Kim, Deug J.

102
Method of the production of polycrystalline silicon thin films

Ahn, Byung Tae; Moon, Dae G.; Lee, Jeong N.

103
Microwave dielectric ceramic composition

Kim, Ho-Gi; Park, Yung

104
Nanocomposite material containing bnnps and method for preparing same

Hong, Soon Hyung; Ryu, Ho Jin; Yoo, Sung Chan

105
Nanoscale patterning method and integrated device for electronic apparatus manufactured therefrom

김상욱; 문형석, 2017-11-07

106
NANOTRANSFER PRINTING METHOD AND SURFACE-ENHANCED RAMAN SCATTERING SUBSTRATE

정연식; 정재원; 양세련; 김종민, 2017-08-30

107
Nitrogen-doped transparent graphene film and manufacturing method thereof

Kim, Sang Ouk; Hwang, Jin Ok; Lee, Duck Hyun, 2014-05-13

108
Non-ferroelectric high dielectric and preparation method thereof

Chung, Sung-Yoon; Yoon, Hye In; Jo, Gi Young

109
PARTICLE INCLUDING ATOMIC-SCALE CHANNEL, METHOD OF PREPARING THE SAME, AND CATALYST INCLUDING THE SAME

Kang, Jeung Ku; Jeong, Hyungmo; Kwon, Youngkook; Kim, Beom-sik

110
Perovskite oxide catalyst having improved oxygen catalytic activity and preparation method thereof

Chung, Sung-Yoon; Bak, Ju Mi

111
PHASE-CHANGE MEMORY DEVICE, FLEXIBLE PHASE-CHANGE MEMORY DEVICE USING INSULATING NANO-DOT AND MANUFACTURING METHOD FOR THE SAME

Jung, Yeon Sik; Lee, Keonjae; Jeong, Jae Won; Choi, Jae Suk; Hwang, Geon Tae; Mun, Beom Ho; You, Byoung Kuk; et al, 2014-09-02

112
PHOTO-CURABLE TRANSPARENT RESIN COMPOSITION

Bae, Byeong-Soo; YANG SeungCheol, 2015-04-28

113
Photoelectrode including catalyst retaining layer, method of preparing the same, and photoelectrochemical cell including photoelectrode

Shin, Byungha; Koo, Bonhyeong; Byun, Segi

114
Planar metalens and cover glass including the same

Shin, Jonghwa; Chang, Taeyong

115
Plasma display panel and low temperature fabrication method thereof

배병수, 2011-01-11

116
Pliable carbonaceous pocket composite structure, method for preparing the same, electrode, including the same, and energy storage device including the electrode

강정구; 원종호; 정형모

117
Polymer substrate for flexible display having enhanced flexibility

Yoon, Choon Sup; Sung, Youngchul; Cho, Dong-Ho; Jeon, DukYoung, 2012-05-01

118
POLYMER-GRAPHENE LIQUID CRYSTAL FIBER AND A CARBON FIBER PRODUCED BY THE SAME AND METHOD FOR MANUFACTURING THE SAME

Kim, Sang Ouk; Kim, In Ho

119
Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using same

백경욱; 장경운; 조성동, 2008-06-03

120
Porous semiconductor metal oxide complex nanofibers including nanoparticle catalyst functionalized by nano-catalyst included within metal-organic framework, gas sensor and member using the same, and method of manufacturing the same

Kim, Il-Doo; Koo, Wontae; Jang, Jisu

121
Positive electrode active material having improved safety and lifetime characteristics and lithium secondary battery comprising the same

강기석; 서동화; 홍지현; 오송택; 김재국, 2017-02-14

122
Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate

백경욱, 2001-05-01

123
Process for making oxide dispersion-strengthened tungsten heavy alloy by mechanical alloying

Hong, Soon-Hyung; Ryu, Ho Jin, 2002-04-09

124
Process for preparing a polycrystalline silicon thin film

Ahn, Byung-Tae; Kim, Do-Kyung; Kim, Jong-Hee; Lee, Jeong-No; Kim, Yoon-Chang, 2003-03-04

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