Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive

Abstract

Disclosed is a method for fabricating wafer-level flip chip packages using anisotropic conductive adhesive. A low-priced non-solder bump, such as a gold stud bump or an electroless nickel/gold bump, is formed on an I/O pad of each chip of a wafer obtained by semiconductor processes. An anisotropic conductive adhesive solution or film is applied onto the wafer, followed by dicing the wafer into individual chips. They are arranged on and heat-pressed against a substrate at 150� C. for 5 min with the aid of a flip chip bonder. Each of the chips is mechanically and electrically connected to the substrate via the anisotropic conductive adhesive. Thus, the method can accomplish low-priced flip chip packaging or chip size packaging simply using conventional packaging lines.