Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Title
Showing results 15921 to 15940 of 19291
| Wafer level ACA packages and their applications to advanced electronic packaging Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09 |
| Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30 |
| Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs) Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wook, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01 |
| Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27 |
| Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection Lee, Hyeong-Gi; Choi, Yong-Won; Shin, Ji-won; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 |
| Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs) Paik, Kyung-Wook; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 123, 2007-01-15 |
| Wafer level packages using anisotropic conductive adhesive for flip chip assembly = 이방성 전도성 접착제 용액을 이용한 웨이퍼 레벨 패키지에 관한 연구link Kim, Il; 김일; et al, 한국과학기술원, 2008 |
| Wafer to wafer bonding using electroplated Co-Sn solder layer Kim, SH; Yu, Jin, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316, 123, 2008-10-22 |
| Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08 |
| Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs) Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07 |
| Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05 |
| Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection Lee, Hyeong Gi; Choi, Yong-Won; Shin, Ji Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.11, pp.1567 - 1572, 2015-11 |
| Wafer-Scale Fabrication and Characterization of Thin-Film Transistors with Polythiophene-Sorted Semiconducting Carbon Nanotube Networks Liyanage, Luckshitha Suriyasena; Lee, Hangwoo; Patil, Nishant; Park, Steve; Mitra, Subhasish; Bao, Zhenan; Wong, Hon Sum Philip, ACS NANO, v.6, no.1, pp.451 - 458, 2012-01 |
| Wafer-Scale Synthesis of Highly Oriented 2D Topological Semimetal PtTe2 via Tellurization Choi, Minhyuk; Oh, Saeyoung; Hahn, Sungsoo; Ji, Yubin; Jo, Min-kyung; Kim, Jeongtae; Ju, Tae-Seong; et al, ACS Nano, v.18, no.23, pp.15154 - 15166, 2024-06 |
| Wafer-scale synthesis of monolayer two-dimensional porphyrin polymers for hybrid superlattices Zhong, Yu; Cheng, Baorui; Park, Chibeom; Ray, Ariana; Brown, Sarah; Mujid, Fauzia; Lee, Jae-Ung; et al, SCIENCE, v.366, no.6471, pp.1379 - 1384, 2019-12 |
| Wafer-Scale Unidirectional Alignment of Supramolecular Columns on Faceted Surfaces Jin, Hyeong Min; Park, Kangho; Kwon, Kiok; Yang, Geon Gug; Han, Young-Soo; Kim, Hwa Soo; Kim, Sang Ouk; et al, ACS NANO, v.15, no.7, pp.11762 - 11769, 2021-07 |
| Warm white LEDs에 적용을 위한 3색 발광 $La_{0.827}Al_{11.9}O_{19.09}:Eu^{2+}, Mn^{2+}$ 형광체의 합성 및 발광 특성 연구 = Synthesis of tunable full color emitting $La_{0.827}Al_{11.9}O_{19.09}:Eu^{2+}, Mn^{2+}$ phosphor for the application to warm white LEDs and its characterizationlink 원유호; Won, Yu-Ho; et al, 한국과학기술원, 2006 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
| Water absorption characteristics of fluorinated silicon oxide films deposited by electron cyclotron resonance plasma enhanced chemical vapor deposition using SiH4, SiF4 and O-2 Byun, KM; Lee, Won-Jong, THIN SOLID FILMS, v.376, no.1-2, pp.26 - 31, 2000-11 |
| Water as a hole-predatory instrument to create metal nanoparticles on triple-conducting oxides Kim, Jun Hyuk; Hong, Jaewoon; Lim, Dae-Kwang; Ahn, Sejong; Kim, Jinwook; Kim, Jun Kyu; Oh, DongHwan; et al, ENERGY & ENVIRONMENTAL SCIENCE, v.15, no.3, 2022-03 |
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