Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection

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Publisher
IEEE Electronic Components and Technology Conference
Issue Date
2015-05-27
Language
English
Citation

65th Electronic Components and Technology Conference

URI
http://hdl.handle.net/10203/225020
Appears in Collection
MS-Conference Papers(학술회의논문)
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