DSpace at KOASAS: Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection

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Lee, Hyeong-Gi / Choi, Yong-Won / Shin, Ji-won / Paik, Kyung-Wook researcher

Publisher: IEEE Electronic Components and Technology Conference

Issue Date: 2015-05-27

Language: English

Citation: 65th Electronic Components and Technology Conference

URI: http://hdl.handle.net/10203/225020

Appears in Collection: MS-Conference Papers(학술회의논문)

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Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection

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