Browse "College of Engineering(공과대학)" by Author Song, Jun-Yeob
Showing results 1 to 5 of 5
| A new wafer level TSV build-up stacking using oxide bonding Kim, Sun-Rak; Song, Jun-Yeob; Lee, Seung-Seob; Lee, Jae-Hak, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.23, no.6, 2013-06 |
| A study on the Edge traces technique for 3D stack chip Lee, Jae Hak; Yoo, Choong-Don; Song, Jun-Yeob; Lee, Seung-Seob; Kim, Sun-Rak, IEEE International 3D System Integration Conference (3DIC), pp.1 - 4, IEEE, 2011-02 |
| Design of Highly Uniform Spool and Bar Horns for Ultrasonic Bonding Kim, Sun-Rak; Lee, Jae-Hak; Yoo, Choong-Don; Song, Jun-Yeob; Lee, Seung-Seob, IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, v.58, no.10, pp.2194 - 2201, 2011-10 |
| Efficient Wafer-Level Edge-Tracing Technique for 3-D Interconnection of Stacked Die Kim, Sun-Rak; Lee, Phil-Lip; Lee, Jae-Hak; Song, Jun-Yeob; Yoo, Choong-Don; Lee, Seung-Seob, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.6, pp.1048 - 1054, 2012-06 |
| Investigation of interfacial phenomena of alloyed Au wire bonding Kim, Hyoung-Joon; Song, Min-Seok; Paik, Kyung-Wook; Moon, Jeong-Tak; Song, Jun-Yeob, 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, pp.479 - 482, 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, 2013-12-11 |
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