Investigation of interfacial phenomena of alloyed Au wire bonding

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Publisher
2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
Issue Date
2013-12-11
Language
ENG
Citation

2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, pp.479 - 482

URI
http://hdl.handle.net/10203/194614
Appears in Collection
MS-Conference Papers(학술회의논문)
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