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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Investigation of interfacial phenomena of alloyed Au wire bonding

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Kim, Hyoung-Joon / Song, Min-Seok / Paik, Kyung-Wookresearcher / Moon, Jeong-Tak / Song, Jun-Yeob
Publisher
2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
Issue Date
2013-12-11
Language
English
Citation

2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, pp.479 - 482

URI
http://hdl.handle.net/10203/194614
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MS-Conference Papers(학술회의논문)
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