Browse "College of Engineering(공과대학)" by Author Paik, KW
Showing results 1 to 15 of 15
| A study on reliability of flip-chip solder joints using Pb-free solders and electroless Ni-P UBMs Lee, Soon-Bok; Paik, KW; Jeon, YD; Yang, SY; Kwon, YM, Pan Pacific Microelectronics symposium, 2005 |
| Die Shear test of the coined solder bumps package with various UBM and solder materials Lee, Soon-Bok; Hwang, TK; Nah, JW; Paik, KW, , 2003 |
| Effect of Ag on ripening growth of Cu6Sn5 grains formed between molten Sn-xAg-0.5Cu solders and Cu Cho, MG; Park, YS; Seo, SK; Paik, KW; Lee, Hyuck Mo, 60th Electronic Components and Technology Conference, ECTC 2010, pp.170 - 175, 123, 2010-06-01 |
| Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF) Park, JH; Chung, CK; Paik, KW; Lee, Soon-Bok, International Confernce on Experimental Mechanics, 2006, v.326-328 I, pp.517 - 520, 2006 |
| Effects of Solder Alloys on Reliability of Low Cost Flip Chip Solder Joints using Electroless Ni-P UBMs Jeon, Young Doo; Yang, Se Young; Paik, KW; Lee, Soon-Bok, IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006-12 |
| Experimental analysis on the mechanism of moisture induced interface weakening in ACF package Sim, Gidong; Chung, CK; Paik, KW; Lee, Soon-Bok, European Microelectronics and Packaging Conference, EMPC 2009, European Microelectronics and Packaging Conference, EMPC 2009, 2009-06-15 |
| Fracture toughness assessment of ACF flip-chip packages under high moisture condition with Moire interferometry Park, JH; Jang, JW; Jang, KW; Paik, KW; Lee, Soon-Bok, 2009 European Microelectronics and Packaging Conference, EMPC 2009, EMPC, 2009-06-15 |
| Nemerical Analysis of Coined Eutectic Solder Bumps Lee, Soon-Bok; Hwang, TK; NAH, JW; Paik, KW, KSME 2002 Conference of Materials and Fracture Division,KSME 02MF025, pp.158 - 163, 2002 |
| Numerical Simulation of the Formation of Coined Solder Bump Hwang, T.K; Lee, Soon-Bok; Nah, JW; Paik, KW, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.388 - 392, 2001 |
| Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire Park, JH; Jang, KW; Paik, KW; Lee, Soon-Bok, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.633 - 638, 123, 2008-12-09 |
| Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, JW; Suk, KL; Paik, KW; Lee, Soon-Bok, 4th International Conference on Experimental Mechanics, pp.119 -, 2009-11-18 |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son, HY; Paik, KW; Kim, I; Park, JH; Lee, Soon-Bok; Jung, GJ; Park, BJ; et al, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724, 2008-12-09 |
| Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008 |
| Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications Son, HY; Kim, IH; Lee, Soon-Bok; Jung, GJ; Park, BJ; Paik, KW, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates Paik, KW; Kim, JS; Oh, SH; Seo, HS, 제5회 한국반도체 학술대회, pp.587 - 588, 한국반도체 학술대회, 1998-02-01 |
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