DSpace at KOASAS: Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

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Son, HY / Paik, KW / Kim, I / Park, JH / Lee, Soon-Bok researcher / Jung, GJ / Park, BJ / Byun, KY

Issue Date: 2008-12-09

Language: ENG

Citation: 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724

URI: http://hdl.handle.net/10203/157338

Appears in Collection: ME-Conference Papers(학술회의논문)

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Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

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