Experimental analysis on the mechanism of moisture induced interface weakening in ACF package

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Publisher
European Microelectronics and Packaging Conference, EMPC 2009
Issue Date
2009-06-15
Language
English
Citation

European Microelectronics and Packaging Conference, EMPC 2009

URI
http://hdl.handle.net/10203/24739
Appears in Collection
ME-Conference Papers(학술회의논문)
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