DSpace at KOASAS: Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages

DSpace at KOASAS

College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages

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Jang, JW / Suk, KL / Paik, KW / Lee, Soon-Bok researcher

Issue Date: 2009-11-18

Language: ENG

Citation: 4th International Conference on Experimental Mechanics, pp.119 -

URI: http://hdl.handle.net/10203/157704

Appears in Collection: ME-Conference Papers(학술회의논문)

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Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages

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