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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages

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dc.contributor.authorJang, JW-
dc.contributor.authorSuk, KL-
dc.contributor.authorPaik, KW-
dc.contributor.authorLee, Soon-Bok-
dc.date.accessioned2013-03-27T01:01:38Z-
dc.date.available2013-03-27T01:01:38Z-
dc.date.created2012-02-06-
dc.date.issued2009-11-18-
dc.identifier.citation4th International Conference on Experimental Mechanics, v., no., pp.119 --
dc.identifier.urihttp://hdl.handle.net/10203/157704-
dc.languageENG-
dc.titleReliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages-
dc.typeConference-
dc.identifier.scopusid2-s2.0-79958112034-
dc.type.rimsCONF-
dc.citation.beginningpage119-
dc.citation.publicationname4th International Conference on Experimental Mechanics-
dc.identifier.conferencecountrySingapore-
dc.identifier.conferencecountrySingapore-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorJang, JW-
dc.contributor.nonIdAuthorSuk, KL-
dc.contributor.nonIdAuthorPaik, KW-
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ME-Conference Papers(학술회의논문)
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