Browse "MS-Journal Papers(저널논문)" by Title
Showing results 301 to 320 of 7284
| Active-Matrix Driven Flexible Pressure Sensor Array Using Oxide Thin-Film Diode Yeom, Hye-In; Kim, Jingyu; Jeon, Guk-Jin; Kim, Joohyeong; Park, Sang-Hee Ko, IEEE ELECTRON DEVICE LETTERS, v.44, no.5, pp.801 - 804, 2023-05 |
| Active-matrix micro-light-emitting diode displays driven by monolithically integrated dual-gate oxide thin-film transistors Yang, Junghoon; Park, HyunWoo; Kim, Baul; Cho, Yong-Hoon; Park, Sang-Hee Ko, JOURNAL OF MATERIALS CHEMISTRY C, v.10, no.26, pp.9699 - 9706, 2022-07 |
| Addition of aluminum to solution processed conductive indium tin oxide thin film for an oxide thin film transistor Jeon, Jun-Hyuck; Hwang, Young-Hwan; Bae, Byeong-Soo; Kwon, H. L.; Kang, H. J., APPLIED PHYSICS LETTERS, v.96, no.21, pp.212109 - 212109, 2010-05 |
| Addition of iminium salts to the reductively activated benzene in [Mn(eta(4)-C6H6)(CO)(3)](-) Park, SHK; Geib, SJ; Cooper, NJ, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.119, no.35, pp.8365 - 8366, 1997-09 |
| Addition of the iminium salt [Me2N=CMe2][BF4] to the reductively activated benzene in [Cr(eta(4)-C6H6)(CO)(3)](2-) Bao, J; Park, SHK; Geib, SJ; Cooper, NJ, ORGANOMETALLICS, v.22, no.16, pp.3309 - 3312, 2003-08 |
| Additive manufacturing of titanium-base alloys with equiaxed microstructures using powder blends Choi, Gwanghyo; Choi, Won Seok; Han, Jeongho; Choi, Pyuck-Pa, ADDITIVE MANUFACTURING, v.36, pp.101467, 2020-12 |
| Additive Soft-Lithographic Patterning of Submicrometer- and Nanometer-Scale Large-Area Resists on Electronic Materials Ahn, Heejoon; Lee, Keonjae; Shim, Anne; Rogers, John A; Nuzzo, Ralph G., NANO LETTERS, v.5, no.12, pp.2533 - 2537, 2005-10 |
| Adhesion and Diffusion Barrier Properties of Ta Films Fabricated by Auxiliary Plasma Assisted Bias Sputtering Kim, Yong-Chul; Lee, Do-Seon; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.49, no.7, 2010-07 |
| Adhesion and Diffusion Barrier Properties of Ta Films Fabricated by Auxiliary Plasma Assisted Bias Sputtering Kim, Yong-Chul; Lee, Do-Seon; Lee, Won-Jong, Japanese Journal of Applied Physics, Vol.49, 2010-07-20 |
| Adhesion and reliability of anisotropic conductive films (ACFs) joints on organic solderability preservatives (OSPs) metal surface finish Kim,Hyoung-Joon; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, pp.1003 - 1011, 2008-07 |
| Adhesion and wear properties of TiN films deposited on martensitic stainless steel and Stellite by reactive magnetron sputter ion plating Lee, MK; Kim, WW; Kim, JS; Lee, Won-Jong, JOURNAL OF NUCLEAR MATERIALS, v.254, no.1, pp.42 - 48, 1998-03 |
| Adhesion behavior of CuCr alloy/polyimide films under 350 degrees C and 85 degrees C/85% RH environments Ahn, EC; Yu, Jin; Park, IS; Lee, Won-Jong, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.10, no.12, pp.1343 - 1357, 1996-04 |
| Adhesion behaviours of hepatocytes cultured onto biodegradable polymer surface modified by alkali hydrolysis process Nam, YoonSung; Yoon, JJ; Lee, JG; Park, TG, JOURNAL OF BIOMATERIALS SCIENCE-POLYMER EDITION, v.10, no.11, pp.1145 - 1158, 1999 |
| ADHESION ENHANCEMENT OF POLYIMIDE ON COPPER BY AR ION-BEAM ETCHING OF COPPER Paik, Kyung-Wook; Ruoff, AL, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.2, no.1, pp.245 - 253, 1988 |
| ADHESION ENHANCEMENT OF THIN COPPER FILM ON POLYIMIDE MODIFIED BY OXYGEN REACTIVE ION-BEAM ETCHING Paik, Kyung-Wook; Ruoff, AL, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.4, no.1, pp.465 - 474, 1990 |
| ADHESION MECHANISMS OF THICK-FILM CONDUCTORS Kim, Ho Gi; ROTHLINGSHOFER, W; TOMANDL, G, SOLID STATE TECHNOLOGY, v.22, no.3, pp.62 - 66, 1979 |
| Adhesion strength of leadframe/EMC interfaces Lee, HY; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.28, no.12, pp.1444 - 1447, 1999-12 |
| Adsorption properties of hydrogen on (10,0) single-walled carbon nanotube through density functional theory Han, SS; Lee, HyuckMo, CARBON, v.42, no.11, pp.2169 - 2177, 2004 |
| Adsorption, dissociation, penetration, and diffusion of N-2 on and in bcc Fe: first-principles calculations Yeo, Sang Chul; Han, Sang Soo; Lee, Hyuck Mo, PHYSICAL CHEMISTRY CHEMICAL PHYSICS, v.15, no.14, pp.5186 - 5192, 2013-04 |
| Advanced Cu/Polymer Hybrid Bonding System for Fine-Pitch 3D Stacking Devices Park, Juseong; Kang, Sukkyung; Kim, Myeong Eun; Kim, Nam Jun; Kim, Jungkyun; Kim, Sanha; Kim, Kyung Min, ADVANCED MATERIALS TECHNOLOGIES, v.8, no.20, 2023-10 |
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