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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Journal Papers(저널논문)

ADHESION ENHANCEMENT OF THIN COPPER FILM ON POLYIMIDE MODIFIED BY OXYGEN REACTIVE ION-BEAM ETCHING

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Paik, Kyung-Wookresearcher / Ruoff, AL
Publisher
VSP BV
Issue Date
1990
Language
English
Article Type
Article
Citation

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.4, no.1, pp.465 - 474

ISSN
0169-4243
DOI
10.1163/156856190X00432
URI
http://hdl.handle.net/10203/66188
Appears in Collection
MS-Journal Papers(저널논문)
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