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Results 11-20 of 119 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints Kwon, YM; Jeon, YD; Paik, Kyung-Wook; Kim, JD; Lee, JW, 7th Electronics Packaging Technology Conference, EPTC 2005, v.1, pp.287 - 291, 2005-12-07 | |
| Study on Coined Solder Bumps on PCB Pads Paik, Kyung-Wook; Nah, JW; Kim, WH; Hur, KR, Proceedings of the 7th Pan Pacific Microelectronics Symposium, pp.79 - 85, 2002-02 | |
| Low Tolerance Epoxy/BaTiO3 Composite Embedded Capacitor Films(ECFs) Paik, Kyung-Wook; Cho, SD; Lee, JY; Hyun, JG, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2002, pp.341 - 347, 2002-12 | |
| Anisotropic Conductive Film for Fine Pitch COG (Chip-on-Glass) Technology Application Yim, MJ; Kwon, WS; Paik, Kyung-Wook, The 5th Korea-Japan International Symposium on Liquid Crystalline Materials and Devices, pp.64 - 65, 2001-05-01 | |
| Effects of BaTiO3 Composite Films and Pastes for High Dielectric Constant and Low Tolerance Embedded Capacitor Fabrication in Organic Substrates Cho, Sung-Dong; Jang, Kyung-Woon; Hyun, Jin-Gul; Paik, Kyung-Wook, 2004 Pan Pacific Microelectronics, pp.109 - 115, 2004 | |
| Reliable Anisotropic Conductive Adhesives Flip Chip Technology on Organic Substrates for High Frequency Applications Paik, Kyung-Wook; Yim, MJ; Kwon, WS, The 6th International Symposium on Microelectronics and Packaging, pp.0 - 0, 2001-04-01 | |
| Low temperature processing for integrated magnetics Lok, BK; Paik, Kyung-Wook; Wai, LL; Fan, W; Lu, ACW; Pramoda, KP, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0 - 0, 2007-11-19 | |
| Applications of Ni and Cu electroless plating techniques for flip chip bumping and under bump metallurgy (UBM) Paik, Kyung-Wook; Jeon, YD; Nah, JW, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.177 - 184, 2001-07-08 | |
| Effect of compressive stresses in Anisotropic Conductive Films (ACFs) on contact resistance of flip chip joint Paik, Kyung-Wook; Kwon, WS, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.141 - 147, 2004-09-12 | |
| Effects of the functional groups of non-conductive films (NCFs) on materials properties and reliability of NCF flip-chip-on-organic boards Chung, CK; Kwon, WS; Park, JH; Lee, Soon-Bok; Paik, Kyung-Wook, International Symposium on Electronics Materials and Packaging, 2005, v.2005, pp.156 - 161, 2005-12-11 |