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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints

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Kwon, YM / Jeon, YD / Paik, Kyung-Wookresearcher / Kim, JD / Lee, JW
Issue Date
2005-12-07
Language
ENG
Citation

7th Electronics Packaging Technology Conference, EPTC 2005, v.1, pp.287 - 291

URI
http://hdl.handle.net/10203/141574
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MS-Conference Papers(학술회의논문)
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