DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kwon, YM | - |
dc.contributor.author | Jeon, YD | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.contributor.author | Kim, JD | - |
dc.contributor.author | Lee, JW | - |
dc.date.accessioned | 2013-03-17T08:26:48Z | - |
dc.date.available | 2013-03-17T08:26:48Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-12-07 | - |
dc.identifier.citation | 7th Electronics Packaging Technology Conference, EPTC 2005, v.1, no., pp.287 - 291 | - |
dc.identifier.uri | http://hdl.handle.net/10203/141574 | - |
dc.language | ENG | - |
dc.title | Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-33847326340 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 1 | - |
dc.citation.beginningpage | 287 | - |
dc.citation.endingpage | 291 | - |
dc.citation.publicationname | 7th Electronics Packaging Technology Conference, EPTC 2005 | - |
dc.identifier.conferencecountry | Singapore | - |
dc.identifier.conferencecountry | Singapore | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Kwon, YM | - |
dc.contributor.nonIdAuthor | Jeon, YD | - |
dc.contributor.nonIdAuthor | Kim, JD | - |
dc.contributor.nonIdAuthor | Lee, JW | - |
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