Effect of compressive stresses in Anisotropic Conductive Films (ACFs) on contact resistance of flip chip joint

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Issue Date
2004-09-12
Language
ENG
Citation

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.141 - 147

URI
http://hdl.handle.net/10203/139464
Appears in Collection
MS-Conference Papers(학술회의논문)
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