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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effect of compressive stresses in Anisotropic Conductive Films (ACFs) on contact resistance of flip chip joint

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Paik, Kyung-Wookresearcher / Kwon, WS
Issue Date
2004-09-12
Language
ENG
Citation

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.141 - 147

URI
http://hdl.handle.net/10203/139464
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MS-Conference Papers(학술회의논문)
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