DSpace at KOASAS: Applications of Ni and Cu electroless plating techniques for flip chip bumping and under bump metallurgy (UBM)

DSpace at KOASAS

College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Applications of Ni and Cu electroless plating techniques for flip chip bumping and under bump metallurgy (UBM)

Cited 0 time in webofscience

Cited 0 time in

Hit : 387
Download : 0

Export

Paik, Kyung-Wook researcher / Jeon, YD / Nah, JW

Issue Date: 2001-07-08

Language: ENG

Citation: Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.177 - 184

URI: http://hdl.handle.net/10203/127656

Appears in Collection: MS-Conference Papers(학술회의논문)

Files in This Item: There are no files associated with this item.

Display Full Item Record

qr_code

트윗하기

KOASAS

Knowledge Service Development Team, KAIST 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea. T. 82-42-350-4493 Email. koasas@kaist.ac.kr
Copyright © 2016. Korea Advanced Institute of Science and Technology. All Rights Reserved.

KOASAS

KOASAS

Browse

Applications of Ni and Cu electroless plating techniques for flip chip bumping and under bump metallurgy (UBM)

KOASAS

Communities & Collections