DC Field | Value | Language |
---|---|---|
dc.contributor.author | Paik, Kyung-Wook | - |
dc.contributor.author | Jeon, YD | - |
dc.contributor.author | Nah, JW | - |
dc.date.accessioned | 2013-03-16T04:58:04Z | - |
dc.date.available | 2013-03-16T04:58:04Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2001-07-08 | - |
dc.identifier.citation | Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, no., pp.177 - 184 | - |
dc.identifier.uri | http://hdl.handle.net/10203/127656 | - |
dc.language | ENG | - |
dc.title | Applications of Ni and Cu electroless plating techniques for flip chip bumping and under bump metallurgy (UBM) | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-0348199253 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 1 | - |
dc.citation.beginningpage | 177 | - |
dc.citation.endingpage | 184 | - |
dc.citation.publicationname | Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Jeon, YD | - |
dc.contributor.nonIdAuthor | Nah, JW | - |
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