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Results 1-10 of 18 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Low temperature processing for integrated magnetics Lok, BK; Paik, Kyung-Wook; Wai, LL; Fan, W; Lu, ACW; Pramoda, KP, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0 - 0, 2007-11-19 | |
| Electrical conducting behavior of hybrid nanocomposites containing carbon nanotubes and carbon black Ma, PC; Zhang, H; Wang, SQ; Wong, YK; Tang, BZ; Hong, SH; Paik, Kyung-Wook; Kim, JK, The 9th International Conference on Electronic Materials and Packaging, EMAP 2007, pp.0 - 0, 2007-11-19 | |
| Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs) Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wook, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01 | |
| Effects of heating rate during ACFs curing process on material properties and thermal cycling reliability of flip chip assembly Jang, KW; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference, 2007, pp.1725 - 1730, IEEE, 2007-05-29 | |
| Effect of electoless Ni/Au UBM thickness on mechanical and electromigration relibility of Pb-free solder joints Kwon, YM; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 | |
| Effects of Anisotropic Conductive Film (ACF) viscosity on ACF fillet and moisture-related reliability for Flip-chip-on-board (FCOB) packages Jang, KW; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 | |
| Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs) Paik, Kyung-Wook; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 123, 2007-01-15 | |
| Thermal stability at the anisotropic conductive films (ACFs) / organic solderability preservatives (OSPs) interface Kim, I; Kim, HJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 | |
| Theoretical prediction and experimental measurement of the degree-of-cure of Anisotropic Conductive Film (ACF) for Chip-On-Flex (COF) applications Chung, CK; Kwon, YM; Kim, I; Son, HY; Choo, KS; Kim, SJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 123, 2007-11-19 | |
| Room temperature ACF bonding process using ultrasonic vibration for chip-on-board and flex-on-board applications Lee, K; Kim, HJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 |
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