Effect of electoless Ni/Au UBM thickness on mechanical and electromigration relibility of Pb-free solder joints
- Publisher
- 123
- Issue Date
- 2007-11-19
- Language
- English
- Citation
The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.