Room temperature ACF bonding process using ultrasonic vibration for chip-on-board and flex-on-board applications

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Publisher
123
Issue Date
2007-11-19
Language
English
Citation

International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0

URI
http://hdl.handle.net/10203/157662
Appears in Collection
MS-Conference Papers(학술회의논문)
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