DSpace at KOASAS
College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Room temperature ACF bonding process using ultrasonic vibration for chip-on-board and flex-on-board applications

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 379
  • Download : 0
Export
Lee, K / Kim, HJ / Paik, Kyung-Wookresearcher
Publisher
123
Issue Date
2007-11-19
Language
English
Citation

International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0

URI
http://hdl.handle.net/10203/157662
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

Display Full Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0