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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Highly Reliable Flip Chip on Flex Package using Multi-layered Anisotropic Conductive Film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2002, pp.0 - 0, 2002-12 | |
| Bubbles formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on ACFs joints reliability Kim, HJ; Hong, SM; Jang, SY; Moon, YJ; Paik, Kyung-Wook, 7th Electronics Packaging Technology Conference, 2005, v.2, pp.734 - 739, 2005-12-07 | |
| A Study on Copper-to-Copper Contacts in NMBITM(Neo-Manthattna Bump Interconnection Structure) Kim, HJ; Paik, Kyung-Wook; Lee, SG; Han, JW; Hwang, JH; Lee, SM, 6th International Conference on Electronic Materials and Packaging, pp.0 - 0, 2004-12-01 | |
| Effects of Electrical Current on the Failure Mechanisms of Au stud bumps/ACF Flip Chip Joints under High Current Stressing Condition Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 5th International Conference on Electronic Materials and Packaging, pp.203 - 208, 2003-11 | |
| Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications Yim, MJ; Hwang, JS; Kim, JG; Kim, HJ; Kwon, W; Jang, KW; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.159 - 164, IEEE, 2004-06-01 | |
| Novel non-conductive films(NCFs) with multi-functional epoxies and silica fillers for reliable NCFs flip-chip-on-organic boards Chung, CK; Kim, HJ; Paik, Kyung-Wook, 2006 International Conference on Electronic Materials and Packaging, EMAP, 123, 2006-12-11 | |
| Thermal stability at the anisotropic conductive films (ACFs) / organic solderability preservatives (OSPs) interface Kim, I; Kim, HJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 | |
| Room temperature ACF bonding process using ultrasonic vibration for chip-on-board and flex-on-board applications Lee, K; Kim, HJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 | |
| Degradation mechanism and reliability of flip chip interconnects using anisotropic conductive adhesives for high current density packaging applications Yim, MJ; Kim, HJ; Chung, CK; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.338 - 343, IEEE, 2006-05-30 | |
| Curing and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection Lee, KW; Kim, HJ; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.918 - 923, IEEE, 2006-05-30 |