Novel non-conductive films(NCFs) with multi-functional epoxies and silica fillers for reliable NCFs flip-chip-on-organic boards
- Publisher
- 123
- Issue Date
- 2006-12-11
- Language
- English
- Citation
2006 International Conference on Electronic Materials and Packaging, EMAP
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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