DSpace at KOASAS: Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

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Yim, MJ / Hwang, JS / Kim, JG / Kim, HJ / Kwon, W / Jang, KW / Paik, Kyung-Wook researcher

Publisher: IEEE

Issue Date: 2004-06-01

Language: ENG

Citation: Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.159 - 164

ISSN: 0569-5503

URI: http://hdl.handle.net/10203/1392

Appears in Collection: MS-Conference Papers(학술회의논문)

Files in This Item: FC_92.pdf(565.55 kB)Download

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