Browse "MS-Conference Papers(학술회의논문)" by Title
Showing results 5541 to 5560 of 7321
| Structural Stability of Charged Cu NAnoparticle Using Density Functional Theory 신기현; 여상철; 류명신; 이혁모, 대한금속재료학회 추계 학술대회, 대한금속재료학회, 2012-10-26 |
| Structural Strategies to Enhance Oxygen Reduction Reaction of Ag: Ag-AgCl Core-shell Nanowires Decorated with AgCl Particles 최수연; 이혁모; 이창수; 구자현, 대한금속재료학회 추계 학술 대회, 대한금속재료학회 추계 학술 대회, 2021-10-22 |
| Structure and field electron emission of carbon nanotubes dependent on growth temperature Huh, Y; Lee, Jeong Yong; Lee, TJ; Lyu, SC; Lee, CJ, Functional Nanostructured Materials through Multiscale Assembly and Novel Pattering Techniques, pp.127 - 131, MRS, 2002-04-02 |
| Structure and optical properties of the Ca/Ag double layer for transparent cathode in TEOLED Kim, BK; Moon, DG; Ahn, Byung Tae, IMID/IDMC 2006: 6th Internaional Meeting on Information Display and the 5th International Display Manufacturing Conference, pp.1071 - 1074, 2006-08-22 |
| Structure and properties of LiTaO3 solid solution in Li2O-Al2O3-Ta2O5 ternary system Ho-Gi Kim, , 1996-01-01 |
| Structure Changes of P2 Layered Material via in situ XRD studies during Desodiation/Sodiation Jung, Young Hwa; Christiansen, Ane S.; Johnsen, Rune E.; Kim, Do Kyung; Norby, Poul, 18th International Meeting on Lithium Batteries, The Electrochemical Society, 2016-06-20 |
| Structure Engineering with ZrO2 Thin Film for Highly Conducting Electrospun In2O3 Nanowire Field Effect Transistor Park, Hyungjin; Lee, In Jun; Kim, Yun Hyeok; Bae, Byeong-Soo, 23rd International Display Workshops in conjunction with Asia Display, IDW/AD 2016, Society for Information Display, 2016-12 |
| Studies of Nano Science and Technology using Ferroelectrics Choi, Si-Kyung, The 2nd Student-Organizing International Mini-Conference on Information Electronics System, 2004 |
| Studies of PQ-100(TM) Polyquinoline Film for Multichip Module(MCM) Applications Paik, Kyung-Wook; Cole, HS; Hendricks, NH, 1992 MRS Spring Meeting, pp.161 - 166, MRS, 1992-03-01 |
| Studies on double-layered metal bumps for fine pitch flip chip applications Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; et al, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11 |
| Studies on Microvoids at the Interface of Direct Bonded Silicon Wafers 강상원, 제2회 한국진공학회 학술발표회, 1992 |
| Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability 전영두; 백경욱, 한국 마이크로 전자 및 패키징학회 추계 기술심포지움, pp.67 - 71, 한국 마이크로 전자 및 패키징학회, 2000-11-01 |
| Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29 |
| Studies On PVA-PVDF Based Solid Polymer Blend Electrolytes Lee, Jai Young, 6th International Conference on New Energy Systems and Conversions, 2003 |
| Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications Paik, Kyung-Wook; Mogro-Campero, A; Turner, L, 44th ECTC Proceeding, pp.326 - 336, 1994-03-01 |
| Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28 |
| Studies on the Microvoids at the Interface of Direct Bonded Silicon Wafers Sang-Won Kang, ESC Proc. of the 1st Interanational Conf. on Semiconductor Wafer Bonding, Science, Technology and Application, pp.102 -, 1991 |
| Studies on the Surface Morphology of BCB films by Plasma Ions Paik, Kyung-Wook; Saia, RJ; Chera, JJ, Proc. Mat. Res. Soc. Symp, pp.303 - 308, 1991-03-01 |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son H.-Y.; Kim I.; Park J.-H.; Lee S.-B.; Jung G.-J.; Park B.-J.; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.2035 - 2043, 2008-05-27 |
| Studies on thin film integral passive components for mixed mode multichip module (MCM) applications Paik, Kyung-Wook, Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology, pp.365 - 368, 1995-12-04 |
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