Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications
- Issue Date
- 1994-03-01
- Language
- ENG
- Citation
44th ECTC Proceeding, pp.326 - 336
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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