DSpace at KOASAS: Enhancing Mechanical Reliability in Thin Film Encapsulation Using Low-Temperature Atomic Layer Deposition

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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Enhancing Mechanical Reliability in Thin Film Encapsulation Using Low-Temperature Atomic Layer Deposition

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Oh, Seung Jin / Lee, Sun-Woo / Ham, Yeong Seok / Kwon, Jeong Hyun / Kim, Taek-Soo researcher

Publisher: The Korean Society of Mechanical Engineers

Issue Date: 2023-11-08

Language: English

Citation: The 14th International Symposium on NDT in Aerospace (AeroNDT2023)

URI: http://hdl.handle.net/10203/317428

Appears in Collection: ME-Conference Papers(학술회의논문)

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