DSpace at KOASAS: Kim, Taek-Soo Researcher page

DSpace at KOASAS

Researcher Page

Kim, Taek-Soo (김택수)Email

부교수, Department of Mechanical Engineering(기계공학과)

http://aptf.kaist.ac.kr

Research Area: Mirco-Fracture and Material Behavior, Mechanics of Materials, Thin Film Engineering

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NO	Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1	Comparison of the mechanical properties of polymer blend and main-chain conjugated copolymer films with donor?acceptor heterojunctions Kim, Young Un; Ma, Boo Soo; Kim, Youngno; et al, CHEMICAL ENGINEERING JOURNAL, v.415, 2021-07
2	Enhanced Triboelectric Nanogenerator Based on Tungsten Disulfide via Thiolated Ligand Conjugation Kim, Tae In; Park, Ick-Joon; Kang, Sumin; et al, ACS APPLIED MATERIALS & INTERFACES, v.13, no.18, pp.21299 - 21309, 2021-05
3	Unveiling the Annealing-Dependent Mechanical Properties of Freestanding Indium Tin Oxide Thin Films Oh, Seung Jin; Kwon, Jeong Hyun; Lee, Sangmin; et al, ACS APPLIED MATERIALS & INTERFACES, v.13, no.14, pp.16650 - 16659, 2021-04
4	A Flash-Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin-Film mu LEDs Shin, Jung Ho; Park, Jung Hwan; Seo, Jeongmin; et al, Advanced Materials, v.33, no.13, pp.2007186, 2021-04
5	Selective Defect Passivation and Topographical Control of 4-Dimethylaminopyridine at Grain Boundary for Efficient and Stable Planar Perovskite Solar Cells Song, Seulki; Park, Eun Young; Ma, Boo Soo; et al, ADVANCED ENERGY MATERIALS, v.11, no.10, pp.2003382, 2021-03
6	Enhanced stretchability of metal/interlayer/metal hybrid electrode Han, Seungseok; Seo, Ki-Won; Kim, Wansun; et al, NANOSCALE, v.13, no.8, pp.4543 - 4550, 2021-02
7	Side Chain Engineered Naphthalene Diimide-Based Terpolymer for Efficient and Mechanically Robust All-Polymer Solar Cells Lee, Jin-Woo; Choi, Nayoun; Kim, Dongjun; et al, CHEMISTRY OF MATERIALS, v.33, no.3, pp.1070 - 1081, 2021-02
8	Ester-functionalized, wide-bandgap derivatives of PM7 for simultaneous enhancement of photovoltaic performance and mechanical robustness of all-polymer solar cells You, Hoseon; Jones, Austin L.; Ma, Boo Soo; et al, JOURNAL OF MATERIALS CHEMISTRY A, v.9, no.5, pp.2775 - 2783, 2021-02
9	An Interlocking Fibrillar Polymer Layer for Mechanical Stability of Perovskite Solar Cells Jeong, Seonju; Lee, Inhwa; Kim, Taek-Sooresearcher; et al, ADVANCED MATERIALS INTERFACES, v.7, no.23, 2020-12
10	Record-efficiency flexible perovskite solar cell and module enabled by a porous-planar structure as an electron transport layer Chung, Jaehoon; Shin, Seong Sik; Hwang, Kyeongil; et al, ENERGY & ENVIRONMENTAL SCIENCE, v.13, no.12, pp.4854 - 4861, 2020-12
11	Highly robust nanostructured carbon films by thermal reconfiguration of ionomer binding Pyo, Jae-Bum; Kim, Ji Hun; Kim, Taek-Sooresearcher, JOURNAL OF MATERIALS CHEMISTRY A, v.8, no.46, pp.24763 - 24773, 2020-12
12	Multi-directionally wrinkle-able textile OLEDs for clothing-type displays Choi, Seungyeop; Jo, Woosung; JEON, YONGMIN; et al, NPJ FLEXIBLE ELECTRONICS, v.4, no.1, 2020-11
13	Highly Mobile Levitating Soft Actuator Driven by Multistimuli-Responses Kim, Ji Hun; Pyo, Jae-Bum; Kim, Taek-Sooresearcher, ADVANCED MATERIALS INTERFACES, v.7, no.21, pp.2001051, 2020-11
14	Evaluating Mechanical Properties of 100nm-Thick Atomic Layer Deposited Al2o3 as a Free-Standing Film Koo, Junmo; Lee, Sangmin; Kim, Junmo; et al, SCRIPTA MATERIALIA, v.187, pp.256 - 261, 2020-10
15	나노박막 전사 방법 및 계면 파괴 역학 강수민; 김택수researcher, 마이크로전자 및 패키징학회지, v.27, no.3, pp.9 - 20, 2020-09
16	단면 연마된 실리콘 웨이퍼의 열에 의한 휨 거동 김준모; 구창연; 김택수researcher, 마이크로전자 및 패키징학회지, v.27, no.3, pp.89 - 93, 2020-09
17	Desolvation-Triggered Versatile Transfer-Printing of Pure BN Films with Thermal-Optical Dual Functionality Han, Yujin; Han, Hyeuk Jin; Rah, Yoonhyuk; et al, ADVANCED MATERIALS, v.32, no.38, pp.2002099, 2020-09
18	Sintering-resistant platinum electrode achieved through atomic layer deposition for thin-film solid oxide fuel cells Seo, Han Gil; Ji, Sanghoon; Seo, Jongsu; et al, JOURNAL OF ALLOYS AND COMPOUNDS, v.835, 2020-09
19	플렉서블 디스플레이용 박막 소재 물성 평가 오승진; 마부수; 김형준; et al, 마이크로전자 및 패키징학회지, v.27, no.3, pp.77 - 82, 2020-09
20	Effects of Post-annealing and Co Interlayer Between SiNx and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections Lee, Hyeonchul; Jeong, Minsu; Kim, Gahui; et al, ELECTRONIC MATERIALS LETTERS, v.16, no.4, pp.311 - 320, 2020-07

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