Researcher Page

Kim, Taek-Soo (김택수)
부교수, Department of Mechanical Engineering(기계공학과)
Research Area
Mirco-Fracture and Material Behavior, Mechanics of Materials, Thin Film Engineering
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    NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
    Record-efficiency flexible perovskite solar cell and module enabled by a porous-planar structure as an electron transport layer

    Chung, Jaehoon; Shin, Seong Sik; Hwang, Kyeongil; et al, ENERGY & ENVIRONMENTAL SCIENCE, v.13, no.12, pp.4854 - 4861, 2020-12

    An Interlocking Fibrillar Polymer Layer for Mechanical Stability of Perovskite Solar Cells

    Jeong, Seonju; Lee, Inhwa; Kim, Taek-Sooresearcher; et al, ADVANCED MATERIALS INTERFACES, v.7, no.23, 2020-12

    Highly robust nanostructured carbon films by thermal reconfiguration of ionomer binding

    Pyo, Jae-Bum; Kim, Ji Hun; Kim, Taek-Sooresearcher, JOURNAL OF MATERIALS CHEMISTRY A, v.8, no.46, pp.24763 - 24773, 2020-12

    Highly Mobile Levitating Soft Actuator Driven by Multistimuli-Responses

    Kim, Ji Hun; Pyo, Jae-Bum; Kim, Taek-Sooresearcher, ADVANCED MATERIALS INTERFACES, v.7, no.21, pp.2001051, 2020-11

    Multi-directionally wrinkle-able textile OLEDs for clothing-type displays

    Choi, Seungyeop; Jo, Woosung; JEON, YONGMIN; et al, NPJ FLEXIBLE ELECTRONICS, v.4, no.1, 2020-11

    Evaluating Mechanical Properties of 100nm-Thick Atomic Layer Deposited Al2o3 as a Free-Standing Film

    Koo, Junmo; Lee, Sangmin; Kim, Junmo; et al, SCRIPTA MATERIALIA, v.187, pp.256 - 261, 2020-10

    Sintering-resistant platinum electrode achieved through atomic layer deposition for thin-film solid oxide fuel cells

    Seo, Han Gil; Ji, Sanghoon; Seo, Jongsu; et al, JOURNAL OF ALLOYS AND COMPOUNDS, v.835, 2020-09

    단면 연마된 실리콘 웨이퍼의 열에 의한 휨 거동

    김준모; 구창연; 김택수researcher, 마이크로전자 및 패키징학회지, v.27, no.3, pp.89 - 93, 2020-09

    플렉서블 디스플레이용 박막 소재 물성 평가

    오승진; 마부수; 김형준; et al, 마이크로전자 및 패키징학회지, v.27, no.3, pp.77 - 82, 2020-09

    나노박막 전사 방법 및 계면 파괴 역학

    강수민; 김택수researcher, 마이크로전자 및 패키징학회지, v.27, no.3, pp.9 - 20, 2020-09

    Desolvation-Triggered Versatile Transfer-Printing of Pure BN Films with Thermal-Optical Dual Functionality

    Han, Yujin; Han, Hyeuk Jin; Rah, Yoonhyuk; et al, ADVANCED MATERIALS, v.32, no.38, pp.2002099, 2020-09

    Graphene intercalated free-standing carbon paper coated with MnO2 for anode materials of lithium ion batteries

    Park, Jae Hyun; Choi, Won Yeong; Lee, Sangmin; et al, ELECTROCHIMICA ACTA, v.348, pp.136310, 2020-07

    Effects of Post-annealing and Co Interlayer Between SiNx and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections

    Lee, Hyeonchul; Jeong, Minsu; Kim, Gahui; et al, ELECTRONIC MATERIALS LETTERS, v.16, no.4, pp.311 - 320, 2020-07

    Triad-type, multi-functional compatibilizers for enhancing efficiency, stability and mechanical robustness of polymer solar cells

    Kim, Geon-U; Lee, Young Woong; Ma, Boo Soo; et al, JOURNAL OF MATERIALS CHEMISTRY A, v.8, no.27, pp.13522 - 13531, 2020-07

    Design of ultrathin OLEDs having oxide -based transparent electrodes and encapsulation with sub -mm bending radius

    Kim, Eungjun; Kwon, Jeonghyun; Kim, Cheolgyu; et al, ORGANIC ELECTRONICS, v.82, 2020-07

    Mechanical Modeling of Rollable OLED Display Apparatus Considering Spring Component

    마부수; 조우성; 김완선; et al, 마이크로전자 및 패키징학회지, v.27, no.2, pp.19 - 26, 2020-06

    Human-Palm-Inspired Artificial Skin Material Enhances Operational Functionality of Hand Manipulation

    Heo, Si-Hwan; Kim, Cheolgyu; Kim, Taek-Sooresearcher; et al, ADVANCED FUNCTIONAL MATERIALS, v.30, no.25, pp.2002360, 2020-05

    A Study on the Flexible Chip-on-Fabric Assemblies Using Anisotropic Conductive Films and Metal-Laminated Fabric Substrates

    Jung, Seung-Yoon; Lee, Tae-Ik; Cho, Minsun; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.360 - 367, 2020-03

    Mechanically Robust All-Polymer Solar Cells from Narrow Band Gap Acceptors with Hetero-Bridging Atoms

    Fan, Qunping; Su, Wenyan; Chen, Shanshan; et al, JOULE, v.4, no.3, pp.658 - 672, 2020-03

    Effects of Thickness and Crystallographic Orientation on Tensile Properties of Thinned Silicon Wafers

    Lee, Sangmin; Kim, Jae-Han; Kim, Young Suk; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.2, pp.1 - 1, 2020-02

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